WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2011018862) MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR FABRICATING THE SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/018862    International Application No.:    PCT/JP2010/001358
Publication Date: 17.02.2011 International Filing Date: 01.03.2010
IPC:
H05K 3/00 (2006.01)
Applicants: TATSUTA ELECTRIC WIRE & CABLE CO., LTD. [JP/JP]; 3-1, 2-chome, Iwata-cho, Higashi-Osaka City, Osaka 5788585 (JP) (For All Designated States Except US).
HASHIMOTO, Kazuhiro [JP/JP]; (JP) (For US Only).
MORIMOTO, Syohei [JP/JP]; (JP) (For US Only).
KAWAKAMI, Yoshinori [JP/JP]; (JP) (For US Only).
YAMAGUCHI, Norihiro [JP/JP]; (JP) (For US Only)
Inventors: HASHIMOTO, Kazuhiro; (JP).
MORIMOTO, Syohei; (JP).
KAWAKAMI, Yoshinori; (JP).
YAMAGUCHI, Norihiro; (JP)
Agent: INAOKA, Kosaku; c/o AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS Sun Mullion NBF Tower, 21st Floor 6-12, Minamihommachi 2-chome, Chuo-ku Osaka-shi, Osaka 5410054 (JP)
Priority Data:
2009-187306 12.08.2009 JP
Title (EN) MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR FABRICATING THE SAME
(FR) CARTE DE CIRCUIT IMPRIMÉ SOUPLE MULTI-COUCHES ET SON PROCÉDÉ DE FABRICATION
Abstract: front page image
(EN)There is a demand for a multilayer flexible printed circuit board (multilayer FPC) which includes surface interconnection layers each having a minute circuit configuration and permits higher density mounting. A first double-sided FPC (3) and a second double-sided FPC (4) are laminated via a bonding sheet (2). The bonding sheet (2) has a hole preliminarily formed therein and filled with an electrically conductive paste (11), and the first double-sided FPC (3) and the second double-sided FPC (4) are electrically connected to each other via the electrically conductive paste (11). The first double-sided FPC (3) and the second double-sided FPC (4) are respectively formed with inner layer via-holes (16) and (24), which do not reduce the size of component mounting areas on a first interconnection layer (L1) and a fourth interconnection layer (L2) (outer surface interconnection layers) of the first double-sided FPC (3) and the second double-sided FPC (4).
(FR)Il existe un besoin pour un circuit imprimé souple multi-couches (FPC multicouche) comprenant des couches d'interconnexion de surface ayant chacune une configuration minuscule de circuit et permettant un montage à plus haute densité. Selon l'invention, un premier FPC double face (3) et un second FPC double face (4) sont stratifiés avec une feuille de liaison (2) intercalée. La feuille de liaison (2) comporte un trou ménagé à l'avance dans celle-ci et rempli d'une pâte électriquement conductrice (11), et le premier FPC double face (3) et le second FPC double face (4) sont connectés électriquement l'un à l'autre au moyen de la pâte électriquement conductrice (11). Le premier FPC double face (3) et le second FPC double face (4) sont respectivement formés avec des trous traversant la couche interne (16) et (24), ne réduisant pas la taille des surfaces de montage des composants sur une première couche d'interconnexion (L1) et une quatrième couche d'interconnexion (L2) (couches d'interconnexion de surface extérieure) du premier FPC double face (3) et du second FPC double face (4).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)