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1. (WO2011017154) SILICON WAFER SAWING FLUID AND PROCESS FOR THE USE THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/017154    International Application No.:    PCT/US2010/043509
Publication Date: 10.02.2011 International Filing Date: 28.07.2010
IPC:
H01L 21/301 (2006.01), B24B 53/095 (2006.01), B23Q 11/10 (2006.01), C09K 5/00 (2006.01)
Applicants: SUNSONIX, INC. [US/US]; 859 Pheland Court Milpitas, CA 95035 (US) (For All Designated States Except US).
TREICHEL, Helmuth [US/US]; (US) (For US Only).
BOHLING, Dave [US/US]; (US) (For US Only).
GEORGE, Mark [US/US]; (US) (For US Only)
Inventors: TREICHEL, Helmuth; (US).
BOHLING, Dave; (US).
GEORGE, Mark; (US)
Agent: GOLDSTEIN, Avery, N.; Gifford, Krass, Sprinkle, Anderson & Citkowski,P.C. 2701 Troy Center Drive, Suite 330 Post Office Box 7021 Troy, MI 48007-7021 (US)
Priority Data:
61/229,084 28.07.2009 US
Title (EN) SILICON WAFER SAWING FLUID AND PROCESS FOR THE USE THEREOF
(FR) FLUIDE DE SCIAGE D'UNE TRANCHE DE SILICIUM ET SON PROCÉDÉ D'UTILISATION
Abstract: front page image
(EN)A process is provided in which a metal chelating agent is dissolved in an aqueous or glycol-based cooling fluid to form a chelating solution with a chelating agent concentration. A silicon boule is cut with a saw to detach a silicon wafer from the boule while the interface between the silicon boule and the saw is bathed with the chelating solution during the cutting.
(FR)La présente invention a pour objet un procédé dans lequel un chélateur métallique est dissous dans un fluide de refroidissement aqueux ou à base de glycol pour former une solution chélatante avec une concentration en chélateur. Une boule de silicium est découpée avec une scie pour détacher une tranche de silicium de la boule tandis que l'interface entre la boule de silicium et la scie est baignée dans la solution chélatante pendant la découpe.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)