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1. (WO2011016694) METHOD FOR FABRICATING CORE OF VACUUM INSULATION PANEL, CORE OF VACUUM INSULATION PANEL, AND VACUUM INSULATION PANEL HAVING THE SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/016694    International Application No.:    PCT/KR2010/005174
Publication Date: 10.02.2011 International Filing Date: 06.08.2010
IPC:
F16L 59/065 (2006.01), F16L 59/06 (2006.01), F16L 59/04 (2006.01)
Applicants: LG ELECTRONICS INC. [KR/KR]; 20 Yeouido-dong, Yeongdeungpo-gu Seoul 150-721 (KR) (For All Designated States Except US).
JUNG, Dongju [KR/KR]; (KR) (For US Only).
YOON, Ilseob [KR/KR]; (KR) (For US Only).
HWANG, Minkyu [KR/KR]; (KR) (For US Only).
SHIM, Jinwoo [KR/KR]; (KR) (For US Only).
KIM, Kyungdo [KR/KR]; (KR) (For US Only).
KIM, Youngbae [KR/KR]; (KR) (For US Only)
Inventors: JUNG, Dongju; (KR).
YOON, Ilseob; (KR).
HWANG, Minkyu; (KR).
SHIM, Jinwoo; (KR).
KIM, Kyungdo; (KR).
KIM, Youngbae; (KR)
Agent: PARK, Jang-Won; 3rd Floor, Shinyoung Wacoal Bldg. 49-4 Nonhyun-dong, Gangnam-gu Seoul 135-814 (KR)
Priority Data:
10-2009-0072995 07.08.2009 KR
Title (EN) METHOD FOR FABRICATING CORE OF VACUUM INSULATION PANEL, CORE OF VACUUM INSULATION PANEL, AND VACUUM INSULATION PANEL HAVING THE SAME
(FR) PROCÉDÉ DE FABRICATION DE L'ÂME D'UN PANNEAU ISOLANT SOUS VIDE, ÂME DE PANNEAU ISOLANT SOUS VIDE ET PANNEAU ISOLANT SOUS VIDE COMPRENANT CETTE ÂME
Abstract: front page image
(EN)Disclosed are a method for fabricating a core of a vacuum insulation panel, a core of a vacuum insulation panel, and a vacuum insulation panel having the core. The core is positioned at an inner side of an envelope of a vacuum insulation member, which is formed by bonding synthetic resin material fibers through thermal bonding.
(FR)La présente invention concerne un procédé de fabrication d'une âme d'un panneau isolant sous vide, une âme de panneau isolant sous vide et un panneau isolant sous vide comprenant cette âme. L'âme est positionnée au niveau d'un côté intérieur d'une enveloppe d'un élément isolant sous vide qui est formée par liage de fibres de résine synthétique par thermoliage.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)