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1. (WO2011014751) OVERMOLDED HEAT RESISTANT POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/014751    International Application No.:    PCT/US2010/043877
Publication Date: 03.02.2011 International Filing Date: 30.07.2010
IPC:
B32B 27/34 (2006.01), D04H 1/64 (2006.01), D06M 15/59 (2006.01), D06M 17/08 (2006.01), D06M 13/148 (2006.01), B29C 70/34 (2006.01), B29C 70/06 (2006.01), B29C 65/70 (2006.01), B29C 45/14 (2006.01), C08L 77/00 (2006.01), C08J 5/10 (2006.01), C08J 5/04 (2006.01), B29C 41/20 (2006.01)
Applicants: E. I. DU PONT DE NEMOURS AND COMPANY [US/US]; 1007 Market Street Wilmington, Delaware 19898 (US) (For All Designated States Except US).
WAKEMAN, Martyn, Douglas [GB/CH]; (CH) (For US Only).
KIRCHNER, Olaf, Norbert [DE/CH]; (CH) (For US Only).
YUAN, Shengmei [US/US]; (US) (For US Only)
Inventors: WAKEMAN, Martyn, Douglas; (CH).
KIRCHNER, Olaf, Norbert; (CH).
YUAN, Shengmei; (US)
Agent: SEBREE, Chyrrea, J.; E. I. du Pont de Nemours and Company Legal Patent Records Center 4417 Lancaster Pike Wilmington, Delaware 19805 (US)
Priority Data:
61/229,807 30.07.2009 US
Title (EN) OVERMOLDED HEAT RESISTANT POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION
(FR) STRUCTURES COMPOSITES EN POLYAMIDE SURMOULÉES RÉSISTANTES À LA CHALEUR ET LEURS PROCÉDÉS DE PRÉPARATION
Abstract: front page image
(EN)The present invention relates to the field of overmolded composite structures and processes for making them, particularly it relates to the field of overmolded heat resistant polyamide composite structures. The overmolded composite structure comprises i) a first component having a surface, which surface has at least a portion made of a surface resin composition, and comprising a fibrous material selected from the group consisting of non-woven structures, textiles, fibrous battings and combinations thereof, said fibrous material being impregnated with a matrix resin composition, wherein said surface resin composition and said matrix resin composition are polyamide compositions comprising one or more polyamide resins, and one or more polyhydric alcohols having more than two hydroxyl groups and ii) a second component comprising an overmolding resin composition, wherein said second component is adhered to said first component over at least a portion of the surface of said first component.
(FR)La présente invention concerne des structures composites surmoulées et leurs procédés de fabrication, en particulier des structures composites en polyamide surmoulées résistantes à la chaleur. La structure composite surmoulée comprend i) un premier composant présentant une surface dont au moins une partie est composée d'une résine de surface, et comprenant un matériau fibreux choisi parmi le groupe constitué par les structures non-tissées, les textiles, les nappes fibreuses et leurs combinaisons, ledit matériau fibreux étant imprégné d'une composition de résine de matrice, ladite composition de résine de surface et ladite composition de résine de matrice étant des compositions de polyamides comprenant au moins une résine de polyamide, et au moins un alcool polyhydrique présentant plus de deux groupes hydroxyle et ii) un second composant comprenant une composition de résine de surmoulage, ledit second composant étant collé au dit premier composant au-dessus d'au moins une partie de la surface dudit premier composant.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)