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1. WO2011011357 - ENHANCED BUS BAR SYSTEM FOR AIRCRAFT TRANSPARENCIES

Publication Number WO/2011/011357
Publication Date 27.01.2011
International Application No. PCT/US2010/042517
International Filing Date 20.07.2010
IPC
H05B 3/84 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
3Ohmic-resistance heating
84Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
CPC
H05B 2203/016
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
2203Aspects relating to Ohmic resistive heating covered by group H05B3/00
016Heaters using particular connecting means
H05B 3/84
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
3Ohmic-resistance heating
84Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
H05K 1/0271
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
H05K 1/0274
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0274Optical details, e.g. printed circuits comprising integral optical means
H05K 1/0306
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0306Inorganic insulating substrates, e.g. ceramic, glass
H05K 1/09
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the ; conductive, e.g. ; metallic pattern
Applicants
  • PPG INDUSTRIES OHIO, INC. [US]/[US] (AllExceptUS)
Inventors
  • SHORT, John, R.
Agents
  • SIMINERIO, Andrew, C.
Priority Data
12/839,52320.07.2010US
61/227,11921.07.2009US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ENHANCED BUS BAR SYSTEM FOR AIRCRAFT TRANSPARENCIES
(FR) SYSTÈME AMÉLIORÉ DE BARRE OMNIBUS POUR ÉLÉMENTS TRANSPARENTS D'AÉRONEFS
Abstract
(EN)
A bus bar system includes a non-conductive substrate having a major surface. At least one conductive bus bar is formed over at least a portion of the major surface. A conductive coating is formed over at least a portion of the bus bar and the major surface. An electrically conductive adhesive, such as an isotropically conductive tape or film, is applied over at least a portion of the film/bus bar junction. The system can optionally include a conductive metallic foil adhered to the isotropically conductive adhesive.
(FR)
Un système de barre omnibus comprend un substrat non conducteur ayant une surface principale. Au moins une barre omnibus conductrice est formée sur au moins une partie de la surface principale. Un revêtement conducteur est formé sur au moins une partie de la barre omnibus et de la surface principale. Un adhésif électroconducteur, tel qu'un ruban ou film isotropiquement conducteur, est appliqué sur au moins une partie de la jonction film/barre omnibus. Le système peut facultativement comprendre une feuille métallique conductrice collée à l'adhésif isotropiquement conducteur.
Latest bibliographic data on file with the International Bureau