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1. WO2011010729 - SUBSTRATE-BONDING DEVICE AND METHOD

Publication Number WO/2011/010729
Publication Date 27.01.2011
International Application No. PCT/JP2010/062453
International Filing Date 23.07.2010
IPC
H05K 3/46 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
H05K 3/36 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
36Assembling printed circuits with other printed circuits
CPC
B32B 2310/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2310Treatment by energy or chemical effects
08by wave energy or particle radiation
B32B 2457/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2457Electrical equipment
08PCBs, i.e. printed circuit boards
B32B 37/0015
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
0007involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
0015to avoid warp or curl
B32B 37/1207
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
12characterised by using adhesives
1207Heat-activated adhesive
H01L 24/81
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
81using a bump connector
H03K 3/36
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
KPULSE TECHNIQUE
3Circuits for generating electric pulses; Monostable, bistable or multistable circuits
02Generators characterised by the type of circuit or by the means used for producing pulses
36by the use, as active elements, of semiconductors, not otherwise provided for
Applicants
  • 東レエンジニアリング株式会社 Toray Engineering Co., Ltd. [JP]/[JP] (AllExceptUS)
  • 寺田勝美 TERADA Katsumi [JP]/[JP] (UsOnly)
Inventors
  • 寺田勝美 TERADA Katsumi
Agents
  • 伴俊光 BAN Toshimitsu
Priority Data
2009-17300324.07.2009JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE-BONDING DEVICE AND METHOD
(FR) DISPOSITIF ET PROCÉDÉ DE COLLAGE DE SUBSTRAT
(JA) 基板の貼合せ装置、基板の貼合せ方法、及び、基板貼合せヘッド
Abstract
(EN)
Disclosed is a device that positions a first substrate , which has a wiring/electrode pattern formed on the surface thereof, and a second substrate, which has a wiring/electrode pattern formed on the surface thereof, such that the wiring/electrode patterns on the substrates face each other, and then bonds the substrates together. The disclosed device is provided with: a means for holding the second substrate; a means for bending the held second substrate; and a means for bringing the first substrate and the second substrate close to each other, one of said substrates being coated with a curable resin, and pressing the second substrate towards the first substrate. The disclosed device and method minimize the amount of curable resin coating while preventing the incorporation of voids and increasing the contact area between opposing wiring/electrode patterns with respect to the comparatively large total surface area of the substrates on which wiring/electrode patterns are formed.
(FR)
L'invention porte sur un dispositif qui positionne un premier substrat, ayant un motif de câblage/d'électrode formé sur sa surface, et un second substrat, ayant un motif de câblage/d'électrode formé sur sa surface, de telle manière que les motifs de câblage/d'électrode sur les substrats se font face, et colle ensuite les substrats l'un à l'autre. Le dispositif décrit comprend : un moyen pour tenir le second substrat ; un moyen pour courber le second substrat obtenu ; et un moyen pour amener le premier substrat et le second substrat à proximité l'un de l'autre, l'un desdits substrats étant revêtu d'une résine durcissable, et pousser le second substrat vers le premier substrat. Le dispositif et le procédé décrits minimisent la quantité de revêtement de résine durcissable tout en évitant l'incorporation de vides et en augmentant l'aire de contact entre les motifs de câblage/d'électrode opposés par rapport à l'aire de surface totale comparativement grande des substrats sur lesquels les motifs de câblage/d'électrode sont formés.
(JA)
 表面に配線電極パターンが形成された第一の基板と、表面に配線電極パターンを有する第二の基板とをお互いの前記電極配線パターン同士を対向させて、貼合せをする装置において、前記第二の基板を保持する手段と、前記第二の基板を保持した状態でたわませる手段とを備え、硬化性樹脂が塗布された前記第一の基板もしくは前記第二の基板とを近接させ、前記第二の基板を前記第一の基板に向かって押圧させる手段を備える基板の貼合せ装置。硬化性樹脂の塗布量を最小限に抑えながら、ボイドの混入を防いで、配線電極パターンが形成された比較的広い面積の基板全面に対して、対向する配線電極パターン同士の接触面積を増やして貼り合わせる装置及び方法を提供する。
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