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1. WO2011010457 - PHOTOCURABLE RESIN COMPOSITION

Publication Number WO/2011/010457
Publication Date 27.01.2011
International Application No. PCT/JP2010/004670
International Filing Date 21.07.2010
IPC
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
C08K 5/37 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
36Sulfur-, selenium-, or tellurium-containing compounds
37Thiols
C08L 9/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
9Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
C08L 63/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
08Epoxidised polymerised polyenes
C08L 101/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
02characterised by the presence of specified groups
06containing oxygen atoms
08Carboxyl groups
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
CPC
C08C 19/06
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
CTREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
19Chemical modification of rubber
04Oxidation
06Epoxidation
C08K 5/37
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
36Sulfur-, selenium-, or tellurium-containing compounds
37Thiols
C08L 15/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
15Compositions of rubber derivatives
C08L 63/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
08Epoxidised polymerised polyenes
G03F 7/038
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
038Macromolecular compounds which are rendered insoluble or differentially wettable
H05K 3/287
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
285Permanent coating compositions
287Photosensitive compositions
Applicants
  • 太陽ホールディングス株式会社 TAIYO HOLDINGS CO., LTD. [JP]/[JP] (AllExceptUS)
  • 峰岸 昌司 MINEGISHI, Shoji [JP]/[JP] (UsOnly)
  • 有馬 聖夫 ARIMA, Masao [JP]/[JP] (UsOnly)
Inventors
  • 峰岸 昌司 MINEGISHI, Shoji
  • 有馬 聖夫 ARIMA, Masao
Agents
  • 特許業務法人 天城国際特許事務所 AMAGI INTERNATIONAL PATENT LAW OFFICE
Priority Data
2009-17030321.07.2009JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PHOTOCURABLE RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE PHOTODURCISSABLE
(JA) 光硬化性樹脂組成物
Abstract
(EN)
Disclosed is a resin composition which enables the prevention of absorption of moisture, and also enables the improvement in thermal cycle resistance without deteriorating anti-migration properties. Specifically disclosed is a photocurable resin composition which comprises a resin containing a carboxyl group, a photopolymerization initiator, an epoxidized polybutadiene compound, and a compound containing a styryl group.
(FR)
La présente invention concerne une composition de résine qui permet de prévenir l'absorption d'humidité et permet également d'améliorer la résistance aux cycles thermiques sans dégrader les propriétés antimigration. L'invention concerne en particulier une composition de résine photodurcissable qui comprend une résine contenant un groupe carboxyle, un initiateur de photopolymérisation, un composé de polybutadiène epoxydé et un composé contenant un groupe styryle.
(JA)
 吸湿性を抑えることができ、耐マイグレーション特性を損なうことなく冷熱サイクル耐性を向上させることが可能な樹脂組成物を提供する。 光硬化性樹脂組成物において、カルボキシル基含有樹脂、光重合開始剤、エポキシ化ポリブタジエン化合物、及びスチリル基含有化合物を含有する。
Also published as
Latest bibliographic data on file with the International Bureau