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1. WO2011009658 - DEVICE HAVING A SEMICONDUCTOR ELEMENT AND A HOUSING AND METHOD FOR PRODUCING THE DEVICE

Publication Number WO/2011/009658
Publication Date 27.01.2011
International Application No. PCT/EP2010/057158
International Filing Date 25.05.2010
IPC
H01L 21/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
H01L 23/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
CPC
H01L 21/565
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
565Moulds
H01L 23/3135
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
3107the device being completely enclosed
3135Double encapsulation or coating and encapsulation
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • ROBERT BOSCH GMBH [DE]/[DE] (AllExceptUS)
  • KUNERT, Peter [DE]/[DE] (UsOnly)
  • KLETT, Gustav [DE]/[DE] (UsOnly)
Inventors
  • KUNERT, Peter
  • KLETT, Gustav
Common Representative
  • ROBERT BOSCH GMBH
Priority Data
10 2009 027 995.424.07.2009DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VORRICHTUNG MIT EINEM HALBLEITERBAUELEMENT UND EINEM GEHÄUSE UND VERFAHREN ZUR HERSTELLUNG DER VORRICHTUNG
(EN) DEVICE HAVING A SEMICONDUCTOR ELEMENT AND A HOUSING AND METHOD FOR PRODUCING THE DEVICE
(FR) DISPOSITIF COMPORTANT UN COMPOSANT SEMI-CONDUCTEUR ET UN BOÎTIER ET PROCÉDÉ DE FABRICATION DUDIT DISPOSITIF
Abstract
(DE)
Die Erfindung geht aus von einer Vorrichtung mit einem Halbleiterbauelement und einem Gehäuse, wobei das Gehäuse wenigstens einen elektrischen Anschluß und wenigstens einen Befestigungspunkt aufweist. Der Kern der Erfindung besteht darin, daß das Gehäuse eine erste Umhüllung aus Duroplast aufweist, welche das Halbleiterbauelement im Wesentlichen umschließt. Die Erfindung betrifft auch ein Verfahren zur Herstellung einer Vorrichtung mit einem Halbleiterbauelement und einem Gehäuse.
(EN)
The invention relates to a device having a semiconductor element and a housing, wherein the housing has at least one electric connection and at least one fastening point. It is the object of the invention that the housing is provided with a first sheath of duro plastic, which essentially encloses the semiconductor element. The invention further relates to a method for producing a device having a semiconductor element and a housing.
(FR)
L'invention concerne un dispositif comportant un composant semi-conducteur et un boîtier, le boîtier présentant au moins un raccordement électrique et au moins un point de fixation. La particularité de l'invention tient au fait que le boîtier présente une première enveloppe en plastique thermodurcissable qui entoure sensiblement le composant semi-conducteur. L'invention concerne également un procédé de fabrication d'un dispositif comportant un composant semi-conducteur et un boîtier.
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