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1. WO2011009587 - MECHANICALLY WORKING AND CUTTING SILICON IN AN ALKALINE MILIEU

Publication Number WO/2011/009587
Publication Date 27.01.2011
International Application No. PCT/EP2010/004422
International Filing Date 20.07.2010
IPC
B28D 5/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
DWORKING STONE OR STONE-LIKE MATERIALS
5Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
CPC
B24B 37/0056
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
005Control means for lapping machines or devices
0056taking regard of the pH-value of lapping agents
B24B 37/042
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
04designed for working plane surfaces
042operating processes therefor
B28D 5/007
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
DWORKING STONE OR STONE-LIKE MATERIALS
5Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
007Use, recovery or regeneration of abrasive mediums
Applicants
  • MEYER BURGER AG [CH]/[CH] (AllExceptUS)
  • BLASER SWISSLUBE AG [CH]/[CH] (AllExceptUS)
  • DE AGOSTINI, Antonio [CH]/[CH] (UsOnly)
  • BERGER, Daniel [CH]/[CH] (UsOnly)
  • MINKOWSKI, Claudia [CH]/[CH] (UsOnly)
  • HENDERSON, Alan [CH]/[CH] (UsOnly)
Inventors
  • DE AGOSTINI, Antonio
  • BERGER, Daniel
  • MINKOWSKI, Claudia
  • HENDERSON, Alan
Agents
  • KASCHE, André
Priority Data
09009552.223.07.2009EP
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) MECHANISCHE BEARBEITUNG UND SCHNEIDEN VON SILIZIUM IN ALKALISCHEM MILIEU
(EN) MECHANICALLY WORKING AND CUTTING SILICON IN AN ALKALINE MILIEU
(FR) TRAITEMENT MÉCANIQUE ET DÉCOUPE DE SILICIUM EN MILIEU ALCALIN
Abstract
(DE)
Die vorliegende Erfindung betrifft Verfahren zur formgebenden Bearbeitung eines Siliziumkristalls, bei dem der Siliziumkristall wenigstens an der von einer formgebenden Vorrichtung bearbeiteten Kontaktfläche mit einer alkalischen Flüssigkeit in Kontakt gebracht wird, sowie die Verwendung alkalischer Flüssigkeiten in diesem Verfahren.
(EN)
The present invention relates to methods for the shaping of a silicon crystal, in which at least on the contact face worked by a shaping device, the silicon crystal is brought into contact with an alkaline liquid, and also to the use of alkaline liquids in this method.
(FR)
La présente invention concerne un procédé de façonnage d'un cristal de silicium selon lequel le cristal de silicium est mis en contact avec un liquide alcalin au moins sur la surface de contact traitée par le dispositif de façonnage, ainsi que l'utilisation de liquides alcalins dans ce procédé.
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