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1. WO2011007947 - ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND ELECTRONIC PARTS CONNECTION METHOD USING SAME

Publication Number WO/2011/007947
Publication Date 20.01.2011
International Application No. PCT/KR2010/000477
International Filing Date 27.01.2010
IPC
C09J 9/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
C09J 5/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
02involving pretreatment of the surfaces to be joined
CPC
C08K 7/16
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
7Use of ingredients characterised by shape
16Solid spheres
C09J 11/08
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
08Macromolecular additives
C09J 2203/326
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2203Applications of adhesives in processes or use of adhesives in the form of films or foils
326for bonding electronic components such as wafers, chips or semiconductors
C09J 2301/416
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2301Additional features of adhesives in the form of films or foils
40characterized by the presence of essential components
416use of irradiation
C09J 5/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
06involving heating of the applied adhesive
C09J 9/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
Applicants
  • 한국과학기술원 KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY [KR]/[KR] (AllExceptUS)
  • 백경욱 PAIK, Kyung-Wook [KR]/[KR] (UsOnly)
  • 이기원 LEE, Kiwon [KR]/[KR] (UsOnly)
  • 김승호 KIM, Seung Ho [KR]/[KR] (UsOnly)
Inventors
  • 백경욱 PAIK, Kyung-Wook
  • 이기원 LEE, Kiwon
  • 김승호 KIM, Seung Ho
Agents
  • 권오식 KWON, Oh-Sig
Priority Data
10-2009-006343413.07.2009KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND ELECTRONIC PARTS CONNECTION METHOD USING SAME
(FR) ADHÉSIF CONDUCTEUR ANISOTROPE POUR ADHÉSION D'ONDES ULTRASONORES, ET PROCÉDÉ DE CONNEXION DE PARTIES ÉLECTRONIQUES UTILISANT LEDIT ADHÉSIF
(KO) 초음파 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법
Abstract
(EN)
The present invention relates to an anisotropic conductive adhesive (ACA) which electrically connects a first electrode which is an electrode of a connection portion of a first electronic part and a second electrode which is an electrode of a connection portion of a second electronic part. The anisotropic conductive adhesive for ultrasonic wave adhesion according to the present invention comprises an insulating polymer resin; conductive adhesive particles which melt with heat generated from the ultrasonic waves applied to the anisotropic conductive adhesive; and spacer particles which have a melting point higher than that of the adhesive particles. The adhesive particles are melted and made to come in surface contact with at least one electrode selected from the first electrode and the second electrode, and the first electrode and the second electrode are electrically connected with a constant gap maintained between the first electrode and the second electrode by the spacer particles.
(FR)
L'invention concerne un adhésif conducteur anisotrope (ACA) connectant électriquement une première électrode qui est une électrode d'une partie de connexion d'une première partie électronique et une seconde électrode qui est une électrode d'une partie de connexion d'une seconde partie électronique. L'adhésif conducteur anisotrope pour adhésion d'ondes ultrasonores de l'invention comprend une résine polymère isolante ; des particules adhésives conductrices qui sont fondues par la chaleur générée par les ondes ultrasonores appliquées par l'adhésif conducteur anisotrope ; et des particules d'espacement qui présentent un point de fusion supérieur à celui des particules adhésives. Lesdites particules adhésives sont fondues de façon à venir en contact de surface avec au moins une électrode sélectionnée à partir de la première et de la seconde électrode, la première et de la seconde électrode étant connectées électriquement à un espace maintenu constant entre elles par les particules d'espacement.
(KO)
본 발명은 제1 전자부품의 접속부 전극인 제1전극과 제2 전자부품의 접속부 전극인 제2전극을 전기적으로 접속시키는 이방성 전도성 접착제(ACA; Anisotropic Conductive Adhesives)에 관한 것으로, 본 발명에 따른 초음파 접합용 이방성 전도성 접착제는 절연성 폴리머 수지; 상기 이방성 전도성 접착제에 인가되는 초음파에 의해 발생하는 열에 의해 용융되는 전도성 접합 입자; 및 상기 접합 입자보다 높은 녹는점(melting point)을 갖는 스페이서(spacer) 입자;를 함유하며, 상기 접합 입자가 용융되어 상기 접합 입자와 상기 제1전극 및 상기 제2전극에서 하나 이상 선택된 전극과 면접촉하고 상기 스페이서 입자에 의해 상기 제1전극과 상기 제2전극간 일정한 간극이 유지되어 상기 제1전극과 상기 제2전극이 전기적으로 접속되는 특징이 있다.
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