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1. WO2011007698 - LOW-PERMITTIVITY RESIN COMPOSITION

Publication Number WO/2011/007698
Publication Date 20.01.2011
International Application No. PCT/JP2010/061475
International Filing Date 06.07.2010
IPC
C08L 101/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
C08K 7/26 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7Use of ingredients characterised by shape
22Expanded, porous or hollow particles
24inorganic
26Silicon-containing compounds
C09D 5/25 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
5Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
25Electrically-insulating paints or lacquers
C09D 7/12 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/88; Processes for incorporating ingredients in coating compositions
12Other additives
C09D 201/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
201Coating compositions based on unspecified macromolecular compounds
H01B 3/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
3Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
CPC
C08K 7/26
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
7Use of ingredients characterised by shape
22Expanded, porous or hollow particles
24inorganic
26Silicon- containing compounds
C09D 5/024
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
5Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced
02Emulsion paints ; including aerosols
024characterised by the additives
C09D 7/61
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/00
40Additives
60non-macromolecular
61inorganic
C09D 7/67
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/00
40Additives
66characterised by particle size
67Particle size smaller than 100 nm
C09D 7/68
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/00
40Additives
66characterised by particle size
68Particle size between 100-1000 nm
C09D 7/69
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/00
40Additives
66characterised by particle size
69Particle size larger than 1000 nm
Applicants
  • 花王株式会社 KAO CORPORATION [JP]/[JP] (AllExceptUS)
  • 矢野 聡宏 YANO, Toshihiro [JP]/[JP] (UsOnly)
  • 小松 正樹 KOMATSU, Masaki [JP]/[JP] (UsOnly)
Inventors
  • 矢野 聡宏 YANO, Toshihiro
  • 小松 正樹 KOMATSU, Masaki
Agents
  • 大谷 保 OHTANI, Tamotsu
Priority Data
2009-16525714.07.2009JP
2010-09808921.04.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LOW-PERMITTIVITY RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE À FAIBLE PERMITTIVITÉ
(JA) 低誘電樹脂組成物
Abstract
(EN)
Provided is (1) a low-permittivity resin composition, having a sufficiently low permittivity and dielectric loss tangent, wherein hollow silica particles are dispersed in a matrix resin, said hollow silica particles having a mean diameter between 0.05 μm and 3 μm and a BET specific surface area of less than 30 m2/g. Also provided is (2) a low-permittivity film comprising said low-permittivity resin composition. Further provided is (3) a method for manufacturing the low-permittivity resin composition and low-permittivity film, said method including a step which: prepares either hollow silica particles (A) that contain air inside or core-shell silica particles (B) that enclose a material that is eliminated upon firing, thereby forming hollow regions; fires same at a temperature exceeding 950°C, thereby preparing hollow silica particles (C); and prepares a liquid dispersion wherein the hollow silica particles are dispersed in a matrix resin forming material. Additionally provided is a coating agent (4) for a low-permittivity film, wherein the aforementioned hollow silica particles are dispersed in a matrix resin forming material.
(FR)
L'invention porte sur (1) une composition de résine à faible permittivité, ayant une permittivité et une tangente de paire diélectrique suffisamment faibles, dans laquelle des particules de silice creuses sont dispersées dans une résine de matrice, lesdites particules de silice creuses ayant un diamètre moyen entre 0,05 µm et 3 µm et une aire de surface spécifique BET de moins de 30 m2/g. L'invention porte également sur (2) un film de faible permittivité comprenant ladite composition de résine à faible permittivité. L'invention porte également sur (3) un procédé de fabrication de la composition de résine à faible permittivité et sur un film à faible permittivité, ledit procédé comprenant les étapes consistant à préparer soit des particules de silice creuses (A) qui contiennent de l'air à l'intérieur, soit des particules de silice cœur-écorce (B) qui renferment une matière qui est éliminée lors de la cuisson, permettant ainsi de former des régions creuses ; à cuire celles-ci à une température dépassant 950°C, permettant ainsi de préparer des particules de silice creuses (C) ; et à préparer une dispersion liquide dans laquelle les particules de silice creuses sont dispersées dans une matière de formation de résine de matrice. De plus, l'invention porte sur un agent de revêtement (4) pour un film de faible permittivité, dans lequel les particules de silice creuses mentionnées ci-dessus sont dispersées dans une matière de formation de résine de matrice.
(JA)
 十分に低い誘電率、誘電正接を有する低誘電樹脂組成物、該低誘電樹脂組成物からなる低誘電膜、低誘電樹脂組成物及び低誘電膜の製造方法、並びに低誘電膜用コーティング剤に関する。 (1)平均粒子径が0.05~3μmで、かつBET比表面積が30m2/g未満である中空シリカ粒子が、マトリクス樹脂中に分散されてなる低誘電樹脂組成物、(2)その低誘電樹脂組成物からなる低誘電膜、(3)粒子内部に空気を含有する中空シリカ粒子(A)、又は焼成により消失して中空部位を形成する材料を内包するコアシェル型シリカ粒子(B)を調製し、950℃を超える温度で焼成して、中空シリカ粒子(C)を調製し、それをマトリクス樹脂形成材中に分散させた分散液を調製する工程を含む低誘電樹脂組成物の製造方法、及び(4)前記中空シリカ粒子がマトリクス樹脂形成材中に分散されてなる低誘電膜用コーティング剤である。
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