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1. WO2011007659 - SIGNAL LINE PATH AND METHOD FOR MANUFACTURING SAME

Publication Number WO/2011/007659
Publication Date 20.01.2011
International Application No. PCT/JP2010/060955
International Filing Date 28.06.2010
IPC
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
CPC
H05K 1/0218
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
0216Reduction of cross-talk, noise or electromagnetic interference
0218by printed shielding conductors, ground planes or power plane
H05K 1/028
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0277Bendability or stretchability details
028Bending or folding regions of flexible printed circuits
H05K 2201/0715
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
07Electric details
0707Shielding
0715provided by an outer layer of PCB
H05K 3/28
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
H05K 3/4635
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
4611by laminating two or more circuit boards
4626characterised by the insulating layers or materials
4635laminating flexible circuit boards using additional insulating adhesive materials between the boards
Y10T 29/49155
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
49Method of mechanical manufacture
49002Electrical device making
49117Conductor or circuit manufacturing
49124On flat or curved insulated base, e.g., printed circuit, etc.
49155Manufacturing circuit on or in base
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP] (AllExceptUS)
  • 加藤 登 KATO Noboru [JP]/[JP] (UsOnly)
  • 佐々木 純 SASAKI Jun [JP]/[JP] (UsOnly)
Inventors
  • 加藤 登 KATO Noboru
  • 佐々木 純 SASAKI Jun
Agents
  • 森下 武一 MORISHITA Takekazu
Priority Data
2009-16481913.07.2009JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SIGNAL LINE PATH AND METHOD FOR MANUFACTURING SAME
(FR) PARCOURS DE LIGNE DE SIGNAL, ET PROCÉDÉ DE FABRICATION DE CELUI-CI
(JA) 信号線路及びその製造方法
Abstract
(EN)
Provided is a signal line path capable of being easily curved and a method for manufacturing the same. A laminate (12) is obtained by stacking at least the insulating layers (22a to 22d) in that order from the front side to the back side in the Z direction. The insulating layers (22a to 22d) are made of a flexible material. A ground conductor (30) is adhered to a main surface of the insulating layer (22b) on the front side in the Z direction. A signal line (32) is adhered to a main surface of the insulating layer (22c) on the front side in the Z direction. A ground conductor (34) is adhered to a main surface of the insulating layer (22d) on the front side in the Z direction. The ground conductors (30, 34) and the signal line (32) form a strip line structure. The laminate (12) is curved so that the insulating layer (22d) is located on an inner circumferential side of the insulating layer (22b).
(FR)
La présente invention concerne un parcours de ligne de signal pouvant être aisément incurvé et un procédé de fabrication de celui-ci. Un stratifié (12) est obtenu par empilement au moins des couches isolantes (22a à 22d) dans cet ordre, du côté avant au côté arrière dans l'axe Z. Les couches isolantes (22a à 22d) sont constituées d'un matériau flexible. Un conducteur à la masse (30) est collé à une surface principale de la couche isolante (22b) sur le côté avant, dans l'axe Z. Une ligne de signal (32) est collée à une surface principale de la couche isolante (22c) sur le côté avant, dans l'axe Z. Un conducteur à la masse (34) est collé à une surface principale de la couche isolante (22d) sur le côté avant, dans l'axe Z. Les conducteurs à la masse (30, 34) et la ligne de signal (32) forment une structure de ligne de bande. Le stratifié (12) est incurvé de sorte que la couche isolante (22d) soit située sur un côté circonférentiel interne de la couche isolante (22b).
(JA)
 容易に湾曲させることができる信号線路及びその製造方法を提供する。 積層体(12)は、可撓性材料からなる少なくとも絶縁体層(22a~22d)がz軸方向の正方向側から負方向側へとこの順に積層されてなる。グランド導体(30)は、絶縁シート(22b)のz軸方向の正方向側の主面に固着している。信号線(32)は、絶縁体層(22c)のz軸方向の正方向側の主面に固着している。グランド導体(34)は、絶縁体層(22d)のz軸方向の正方向側の主面に固着している。グランド導体(30,34)及び信号線(32)は、ストリップライン構造をなしている。積層体(12)は、絶縁体層(22d)が絶縁体層(22b)よりも内周側に位置するように湾曲させられる。
Also published as
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