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1. WO2011004961 - LIGHT EMITTING DEVICE EMPLOYING LUMINESCENT SUBSTANCES WITH OXYORTHOSILICATE LUMINOPHORES

Publication Number WO/2011/004961
Publication Date 13.01.2011
International Application No. PCT/KR2010/003302
International Filing Date 26.05.2010
IPC
H01L 33/48 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
H01L 33/50 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
CPC
C09K 11/7792
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
11Luminescent, e.g. electroluminescent, chemiluminescent materials
08containing inorganic luminescent materials
77containing rare earth metals
7783containing two or more rare earth metals one of which being europium
7792Aluminates; Silicates
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 2224/8592
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
85using a wire connector
85909Post-treatment of the connector or wire bonding area
8592Applying permanent coating, e.g. protective coating
H01L 2924/181
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
15Details of package parts other than the semiconductor or other solid state devices to be connected
181Encapsulation
H01L 2924/19107
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
191Disposition
19101of discrete passive components
19107off-chip wires
Applicants
  • SEOUL SEMICONDUCTOR CO., LTD. [KR]/[KR] (AllExceptUS)
  • LEE, Chung Hoon [KR]/[KR] (UsOnly)
  • TEWS, Walter [DE]/[DE] (UsOnly)
  • ROTH, Gundula [DE]/[DE] (UsOnly)
  • STARICK, Detlef [DE]/[DE] (UsOnly)
Inventors
  • LEE, Chung Hoon
  • TEWS, Walter
  • ROTH, Gundula
  • STARICK, Detlef
Agents
  • AIP PATENT & LAW FIRM
Priority Data
10 2009 030 205.024.06.2009DE
10-2009-008194901.09.2009KR
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) LIGHT EMITTING DEVICE EMPLOYING LUMINESCENT SUBSTANCES WITH OXYORTHOSILICATE LUMINOPHORES
(FR) DISPOSITIF ÉLECTROLUMINESCENT EMPLOYANT DES SUBSTANCES LUMINESCENTES DOTÉES DE LUMINOPHORES D'OXYORTHOSILICATE
Abstract
(EN)
A light emitting device having oxyorthosilicate luminophores is disclosed. The light emitting device includes a light emitting diode and luminescent substances disposed around the light emitting diode, to adsorb at least a portion of light emitted from the light emitting diode and emitting light having different wavelength from that of the absorbed light. The luminescent substances have Eu2+-doped silicate luminophores in which solid solutions in the form of mixed phases between alkaline earth metal oxyorthosilicates and rare earth metal oxyorthosilicates are used as base lattices for the Eu2+ activation leading to luminescence. The luminescent substances are used as radiation converters to convert a higher-energy primary radiation, for example, ultra violet (UV) radiation or blue light, into a longer- wave visible radiation and are therefore preferably employed in corresponding light-emitting devices.
(FR)
La présente invention a trait à un dispositif électroluminescent doté de luminophores d'oxyorthosilicate. Le dispositif électroluminescent inclut une diode électroluminescente et des substances luminescentes disposées autour de la diode électroluminescente, en vue d'adsorber au moins une partie de la lumière émise à partir de la diode électroluminescente et d'émettre de la lumière ayant une longueur d'onde différente de celle de la lumière absorbée. Les substances luminescentes sont dotées de luminophores de silicate dopés en Eu2+ dans lesquelles des solutions solides sous forme de phases mixtes entre des oxyorthosilicates de métal alcalino-terreux et des oxyorthosilicates de lanthanide sont utilisés en tant que réseaux de base pour l'activation de Eu2+ provoquant la luminescence. Les substances luminescentes sont utilisées en tant que convertisseurs de rayonnement en vue de convertir un rayonnement primaire de puissance plus élevée, par exemple, un rayonnement ultraviolet (UV) ou une lumière bleue, en un rayonnement visible d'onde plus longue et sont, par conséquent, de préférence utilisées dans des dispositifs électroluminescents correspondants.
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