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1. WO2011004556 - THROUGH-WIRING BOARD AND METHOD OF MANUFACTURING SAME

Publication Number WO/2011/004556
Publication Date 13.01.2011
International Application No. PCT/JP2010/004139
International Filing Date 22.06.2010
IPC
H05K 1/11 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
H01L 23/15 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
15Ceramic or glass substrates
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
H05K 3/40 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
CPC
H01L 23/15
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
15Ceramic or glass substrates
H01L 23/473
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
473by flowing liquids
H01L 23/49827
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49827Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 2924/09701
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
095with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
097Glass-ceramics, e.g. devitrified glass
09701Low temperature co-fired ceramic [LTCC]
H05K 1/0272
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0272Adaptations for fluid transport, e.g. channels, holes
Applicants
  • 株式会社フジクラ Fujikura Ltd. [JP]/[JP] (AllExceptUS)
  • 山本敏 YAMAMOTO, Satoshi [JP]/[JP] (UsOnly)
  • 橋本廣和 HASHIMOTO, Hirokazu [JP]/[JP] (UsOnly)
Inventors
  • 山本敏 YAMAMOTO, Satoshi
  • 橋本廣和 HASHIMOTO, Hirokazu
Agents
  • 志賀正武 SHIGA, Masatake
Priority Data
2009-15986906.07.2009JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) THROUGH-WIRING BOARD AND METHOD OF MANUFACTURING SAME
(FR) CARTE DE CIRCUIT IMPRIMÉ TRAVERSANT ET SON PROCÉDÉ DE FABRICATION
(JA) 貫通配線基板及びその製造方法
Abstract
(EN)
A through-wiring board comprising: a substrate provided with a first surface and a second surface; and through-wiring formed in a through-hole, which penetrates between the first surface and the second surface, by filling an electrically conducting substance into the through-hole or by forming in the through-hole a film of the electrically conducting substance. The through-hole is provided, in a longitudinal cross-section thereof, with a bend section comprising an inner peripheral section which is curved in a recessed shape and an outer peripheral section which is curved in a protruding shape, and at least the inner peripheral section is formed in a circular arc shape in the longitudinal cross-section.
(FR)
La carte de circuit imprimé traversant selon l'invention comprend : un substrat comportant une première surface et une seconde surface ; et un circuit traversant formé dans un trou traversant qui pénètre entre la première et la seconde surface, en remplissant le trou traversant d'une substance électriquement conductrice ou en formant dans le trou traversant une pellicule de la substance électriquement conductrice. Le trou traversant comporte, dans une section transversale longitudinale de ce dernier, une section courbée comprenant une section périphérique intérieure qui est courbée dans une forme évidée et une section périphérique extérieure qui est courbée dans une forme protubérante, et au moins la section périphérique intérieure est formée dans une forme d'arc circulaire dans la section transversale longitudinale.
(JA)
 第1面と第2面とを有する基板と;前記第1面と前記第2面との間を貫通する貫通孔内に、導電性物質を充填又は成膜することにより形成された貫通配線と; を備える貫通配線基板であって、前記貫通孔は、前記貫通孔の縦断面において、凹状に湾曲している内周部及び凸状に湾曲している外周部からなる変曲部を有し;少なくとも前記内周部が、前記縦断面において円弧状に形成されている。
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