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1. WO2011002084 - CONDUCTIVE PARTICLE

Publication Number WO/2011/002084
Publication Date 06.01.2011
International Application No. PCT/JP2010/061333
International Filing Date 02.07.2010
IPC
H01R 11/01 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
11Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
01characterised by the form or arrangement of the conductive interconnection between their connecting locations
C08J 3/12 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
3Processes of treating or compounding macromolecular substances
12Powdering or granulating
H01B 5/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5Non-insulated conductors or conductive bodies characterised by their form
CPC
C08K 9/02
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
9Use of pretreated ingredients
02Ingredients treated with inorganic substances
C09J 11/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
C09J 9/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
H01R 4/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
4Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
04using electrically conductive adhesives
Applicants
  • 日立化成工業株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP]/[JP] (AllExceptUS)
  • 高井 健次 TAKAI Kenji [JP]/[JP] (UsOnly)
  • 赤井 邦彦 AKAI Kunihiko [JP]/[JP] (UsOnly)
  • 永原 憂子 NAGAHARA Yuuko [JP]/[JP] (UsOnly)
  • 松沢 光晴 MATSUZAWA Mitsuharu [JP]/[JP] (UsOnly)
Inventors
  • 高井 健次 TAKAI Kenji
  • 赤井 邦彦 AKAI Kunihiko
  • 永原 憂子 NAGAHARA Yuuko
  • 松沢 光晴 MATSUZAWA Mitsuharu
Agents
  • 長谷川 芳樹 HASEGAWA Yoshiki
Priority Data
2009-15818002.07.2009JP
2009-15818202.07.2009JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CONDUCTIVE PARTICLE
(FR) PARTICULE CONDUCTRICE
(JA) 導電粒子
Abstract
(EN)
Disclosed is a conductive particle which is capable of achieving sufficient conductivity even when used in an anisotropically conductive adhesive that is used for the purpose of connecting a hard and smooth electrode. Specifically disclosed is a conductive particle (1) which comprises: a composite particle (7) that has a plastic core (10) and non-conductive inorganic particles (30) that are adsorbed on the plastic core (10) by a chemical bond; and a metal plating layer (20) that covers the composite particle (7). The metal plating layer (20) has a surface that is provided with projections (20a), and the non-conductive inorganic particles (30) are harder than the metal plating layer (20).
(FR)
La présente invention a trait à une particule conductrice qui est capable d'obtenir suffisamment de conductivité y compris lorsqu'elle est utilisée dans un adhésif conducteur de façon anisotrope qui est utilisé en vue de connecter une électrode dure et lisse. Plus particulièrement, la présente invention a trait à une particule conductrice (1) qui comprend : une particule composite (7) qui est pourvue d'une âme en matière plastique (10) et de particules inorganiques non conductrices (30) qui sont adsorbées sur l'âme en matière plastique (10) par une liaison chimique ; et une couche de revêtement métallique (20) qui recouvre la particule composite (7). La couche de revêtement métallique (20) est dotée d'une surface qui est pourvue de protubérances (20a) et les particules inorganiques non conductrices (30) sont plus dures que la couche de revêtement métallique (20).
(JA)
【課題】硬質で平滑な電極を接続するための異方性導電接着剤に用いられたときであっても、十分な導電性を得ることが可能な導電粒子を提供すること。 【解決手段】プラスチック核体(10)とプラスチック核体(10)に化学結合により吸着した非導電性無機粒子(30)とを有する複合粒子(7)と、複合粒子(7)を覆う金属めっき層(20)と、を備える導電粒子(1)。金属めっき層(20)が、突起部(20a)を形成する表面を有しており、非導電性無機粒子(30)が金属めっき層(20)よりも硬い。
Also published as
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