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1. WO2011002031 - SUBSTRATE FOR MOUNTING COMPONENTS, AND SEMICONDUCTOR MODULE

Publication Number WO/2011/002031
Publication Date 06.01.2011
International Application No. PCT/JP2010/061172
International Filing Date 30.06.2010
IPC
H01L 23/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H01L 23/14 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
H05K 1/05 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
05Insulated metal substrate
CPC
H01L 2224/16227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
16227the bump connector connecting to a bond pad of the item
H01L 2224/16235
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
16235the bump connector connecting to a via metallisation of the item
H01L 2224/451
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 23/3735
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
3735Laminates or multilayers, e.g. direct bond copper ceramic substrates
Applicants
  • 三洋電機株式会社 SANYO ELECTRIC CO., LTD. [JP]/[JP] (AllExceptUS)
  • 臼井 良輔 USUI Ryosuke (UsOnly)
  • 五十嵐 優助 IGARASHI Yusuke (UsOnly)
  • 井上 恭典 INOUE Yasunori (UsOnly)
  • 中里 真弓 NAKASATO Mayumi (UsOnly)
  • 長松 正幸 NAGAMATSU Masayuki (UsOnly)
  • 小原 泰浩 KOHARA Yasuhiro (UsOnly)
Inventors
  • 臼井 良輔 USUI Ryosuke
  • 五十嵐 優助 IGARASHI Yusuke
  • 井上 恭典 INOUE Yasunori
  • 中里 真弓 NAKASATO Mayumi
  • 長松 正幸 NAGAMATSU Masayuki
  • 小原 泰浩 KOHARA Yasuhiro
Agents
  • 角谷 浩 KADOYA Hiroshi
Priority Data
2009-15575130.06.2009JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE FOR MOUNTING COMPONENTS, AND SEMICONDUCTOR MODULE
(FR) SUBSTRAT PERMETTANT DE MONTER DES COMPOSANTS ET MODULE SEMI-CONDUCTEUR
(JA) 素子搭載用基板および半導体モジュール
Abstract
(EN)
Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics.
(FR)
Les cartes de circuit imprimé classiques présentent un problème en ce qu'elles sont mauvaises en termes de caractéristique de rayonnement thermique et les cartes de circuit imprimé à âme métallique adoptées pour améliorer la caractéristique de rayonnement thermique présentent un problème en ce qu'elles ont une faible rigidité et une tendance à plier. La ductilité du métal peut être enrayée et le métal protégé; en recouvrant sensiblement la totalité de la zone des côtés avant et arrière de l'âme métallique, constituée de métal en tant que matériau principal, avec un premier film en céramique et un second film en céramique qui enraient la ductilité de l'âme métallique mentionnée ci-dessus; et en recouvrant chacun des films en céramique avec des films de résine isolés, en vue de recouvrir la fragilité de ces céramiques.
(JA)
 従来のプリント基板は、放熱性に劣り、放熱性を向上させるために採用されたメタルコアのプリント基板は、剛性が小さく、反ってしまうという課題があった。 金属を主材料とする金属コアの表および裏の実質全域に、前記金属コアの延性を阻止する第1のセラミック膜および第2のセラミック膜を被覆し、このセラミックの脆弱性をカバーするためにそれぞれ絶縁樹脂膜を被覆することにより、金属の延性及び保護をすることができる。
Also published as
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