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Machine translation
1. (WO2010150971) APPARATUS FOR COUPLING A MODULE CIRCUIT BOARD AND A FRAME TOGETHER, AND BACKLIGHT USING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/150971    International Application No.:    PCT/KR2010/002278
Publication Date: 29.12.2010 International Filing Date: 13.04.2010
IPC:
G02F 1/1333 (2006.01), G02F 1/1345 (2006.01)
Applicants: LPOINT CO., LTD. [KR/KR]; #214 Gongjang-dong, Sihwa Knowledge Industry Center 672, Seonggok-dong, Danwon-gu, Ansa-si Gyeonggi-do 425-836 (KR) (For All Designated States Except US).
LEE, Jong Eun [KR/KR]; (KR)
Inventors: LEE, Jong Eun; (KR)
Agent: PANKOREA PATENT AND LAW FIRM; Seolim Bldg. 649-10, Yoksam-dong, Kangnam-ku Seoul, 135-080 (KR)
Priority Data:
10-2009-0056649 24.06.2009 KR
Title (EN) APPARATUS FOR COUPLING A MODULE CIRCUIT BOARD AND A FRAME TOGETHER, AND BACKLIGHT USING SAME
(FR) APPAREIL POUR COUPLER À UN CHÂSSIS UN CIRCUIT IMPRIMÉ ÉQUIPÉ D'UN MODULE, ET RÉTROÉCLAIRAGE L'UTILISANT
(KO) 모듈 회로기판과 프레임의 결합장치 및 이를 이용한 백라이트
Abstract: front page image
(EN)According to the present invention, an apparatus for coupling a module circuit board and a frame together comprises: a module circuit board on which light-emitting diodes are arranged into a predetermined pattern; and a frame coupled to the module circuit board by a coupling unit, wherein the coupling unit has coupling grooves formed at the back surface of the module circuit board, and coupling members formed at the frame to be coupled to the respective coupling grooves.
(FR)La présente invention concerne un appareil permettant de coupler à un châssis un circuit imprimé équipé d'un module. Cet appareil comprend: d'une part un circuit imprimé qui est équipé d'un module, et sur lequel des diodes électroluminescentes sont disposées selon un motif prédéterminé, et d'autre part un châssis couplé, par une unité de couplage, au circuit imprimé équipé d'un module. En l'occurrence, l'unité de couplage comporte des rainures de couplages réalisées sur la face postérieure du circuit imprimé équipé d'un module, et des éléments de couplage réalisés sur le châssis de façon à se coupler aux rainures de couplage correspondantes.
(KO)본 발명에 따르면, 모듈 회로기판과 프레임의 결합장치는 발광다이오드들이 소정의 패턴으로 설치되는 모듈 회로기판, 상기 회로기판과 결합유닛에 의해 결합되는 프레임를 구비하며, 상기 결합유닛은 회로기판의 배면에 결합홈이 형성되고, 상기 프레임에 상기 결합홈과 결합되는 결합부재들가 형성된다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)