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Machine translation
1. (WO2010149667) A METHOD FOR PLATING A COPPER INTERCONNECTION CIRCUIT ON THE SURFACE OF A PLASTIC DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/149667    International Application No.:    PCT/EP2010/058845
Publication Date: 29.12.2010 International Filing Date: 22.06.2010
IPC:
C23C 18/30 (2006.01), C23C 18/20 (2006.01)
Applicants: THALES NEDERLAND B.V. [NL/NL]; Zuidelijke Havenweg 40 NL-7550 GD Hengelo (NL) (For All Designated States Except US).
LEGTENBERG, Rob [NL/NL]; (NL) (For US Only).
ADELAAR, Hans [NL/NL]; (NL) (For All Designated States Except US)
Inventors: LEGTENBERG, Rob; (NL)
Agent: LUCAS, Laurent; Immeuble Visium 22, avenue Aristide Briand F-94117 ARCUEIL Cedex (FR)
Priority Data:
09163423.8 22.06.2009 EP
Title (EN) A METHOD FOR PLATING A COPPER INTERCONNECTION CIRCUIT ON THE SURFACE OF A PLASTIC DEVICE
(FR) PROCÉDÉ DE PLACAGE D'UN CIRCUIT D'INTERCONNEXION DE CUIVRE SUR LA SURFACE D'UN DISPOSITIF EN PLASTIQUE
Abstract: front page image
(EN)There is disclosed a method for plating a copper interconnection circuit on the surface of a plastic device. The method comprises a step of depositing an activation layer on the outer surface of the plastic device and a step of plating with copper the outer surface of the plastic device, the activation layer activating plating where copper is needed. The method comprises a step of laser structuring the outer surface of the plastic device, in order to remove the activation layer locally where copper is not needed. Application : highly integrated electronics
(FR)L'invention concerne un procédé de placage d'un circuit d'interconnexion de cuivre sur la surface d'un dispositif en plastique. Le procédé comprend les étapes consistant à : déposer une couche d'activation sur la surface extérieure du dispositif en plastique; et cuivrer la surface extérieure du dispositif en plastique, la couche d'activation activant le dépôt du cuivre là où celui-ci est nécessaire; structurer au laser la surface extérieure du dispositif en plastique afin d'éliminer la couche d'activation localement, aux endroits où le cuivre est inutile. Application : électronique hautement intégrée.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)