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1. (WO2010148313) POLYCRYSTALLINE DIAMOND CUTTING ELEMENTS WITH ENGINEERED POROSITY AND METHOD FOR MANUFACTURING SUCH CUTTING ELEMENTS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/148313    International Application No.:    PCT/US2010/039184
Publication Date: 23.12.2010 International Filing Date: 18.06.2010
IPC:
E21B 10/54 (2006.01), E21B 10/42 (2006.01), B22F 7/06 (2006.01), B22F 3/12 (2006.01)
Applicants: SMITH INTERNATIONAL, INC. [US/US]; 1310 Rankin Road Houston, TX 77073 (US) (For All Designated States Except US).
FAN, Guojiang [CN/US]; (US) (For US Only).
YU, Feng [CN/US]; (US) (For US Only).
FANG, Yi [CN/US]; (US) (For US Only).
BELNAP, J., Daniel [US/US]; (US) (For US Only).
CARIVEAU, Peter, T. [US/US]; (US) (For US Only)
Inventors: FAN, Guojiang; (US).
YU, Feng; (US).
FANG, Yi; (US).
BELNAP, J., Daniel; (US).
CARIVEAU, Peter, T.; (US)
Agent: MARANTIDIS, Constantine; Christie, Parker & Hale, LLP P.O. Box 7068 Pasadena, CA 91109-7068 (US)
Priority Data:
61/218,382 18.06.2009 US
Title (EN) POLYCRYSTALLINE DIAMOND CUTTING ELEMENTS WITH ENGINEERED POROSITY AND METHOD FOR MANUFACTURING SUCH CUTTING ELEMENTS
(FR) ÉLÉMENTS DE COUPE EN DIAMANT POLYCRISTALLIN AVEC POROSITÉ ARTIFICIELLE ET PROCÉDÉ DE FABRICATION DE TELS ÉLÉMENTS DE COUPE
Abstract: front page image
(EN)A method for facilitating infiltration of an infiltrant material into a TSP material during re- bonding of the TSP material to a substrate, by enhancing the porosity of the TSP material near the interface with the substrate is provided. Cutting elements formed by such method and downhole tools including such cutting elements are also provided.
(FR)L'invention porte sur un procédé pour faciliter l'infiltration d'une matière infiltrante dans un matériau polycristallin thermiquement stable (TSP) lors d'une nouvelle liaison du matériau TSP à un substrat, par l'augmentation de la porosité du matériau TSP proche de l'interface avec le substrat. L'invention porte également sur des éléments de coupe formés par un tel procédé et sur des outils de fond de puits comprenant de tels éléments de coupe.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)