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Machine translation
1. (WO2010144252) FRONT END SCRIBING OF LIGHT EMITTING DIODE (LED) WAFERS AND RESULTING DEVICES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/144252    International Application No.:    PCT/US2010/036101
Publication Date: 16.12.2010 International Filing Date: 26.05.2010
Chapter 2 Demand Filed:    16.02.2011    
IPC:
H01L 33/00 (2010.01), H01L 21/78 (2006.01)
Applicants: CREE, INC. [US/US]; 4600 Silicon Drive Durham, North Carolina 27703 (US) (For All Designated States Except US).
DONOFRIO, Matthew [US/US]; (US) (For US Only).
PARKER, Winston T. [US/US]; (US) (For US Only).
BERGMANN, Michael John [US/US]; (US) (For US Only).
GILMORE, Steven Scott [US/US]; (US) (For US Only).
NORMAN, Jay Thomas [US/US]; (US) (For US Only).
SCHNEIDER, Kevin Shawne [US/US]; (US) (For US Only)
Inventors: DONOFRIO, Matthew; (US).
PARKER, Winston T.; (US).
BERGMANN, Michael John; (US).
GILMORE, Steven Scott; (US).
NORMAN, Jay Thomas; (US).
SCHNEIDER, Kevin Shawne; (US)
Agent: MYERS BIGEL SIBLEY & SAJOVEC, P.A.; P.O. Box 37428 Raleigh, North Carolina 27627 (US)
Priority Data:
12/482,165 10.06.2009 US
Title (EN) FRONT END SCRIBING OF LIGHT EMITTING DIODE (LED) WAFERS AND RESULTING DEVICES
(FR) TRACÉ FRONTAL DE TRANCHES DE DIODES ÉLECTROLUMINESCENTES (DEL) ET DISPOSITIFS RÉSULTANTS
Abstract: front page image
(EN)A wafer of light emitting diodes (LEDs) is laser scribed to produce a laser scribing cut. Then, the wafer is cleaned, for example by wet etching, to reduce scribe damage. Then, electrical contact layers for the LEDs are formed on the wafer that has been cleaned. Alternatively, the scribing cut may be produced by multiple etches before contact formation. Related LEDs are also described.
(FR)Selon l'invention, une tranche de diodes électroluminescentes (DEL) est tracée par laser pour produire une découpe de tracé laser. Puis, la tranche est nettoyée, par exemple par gravure humide, pour réduire les dommages de tracé. Puis les couches de contact électrique pour les DEL sont formées sur la tranche qui a été nettoyée. En variante, la découpe de tracé peut être produite par des gravures multiples avant la formation du contact. L'invention concerne également des DEL associées.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)