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Machine translation
1. (WO2010143507) INSULATING RESIN FILM, BONDED BODY USING INSULATING RESIN FILM, AND METHOD FOR MANUFACTURING BONDED BODY
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/143507    International Application No.:    PCT/JP2010/058519
Publication Date: 16.12.2010 International Filing Date: 20.05.2010
Chapter 2 Demand Filed:    24.12.2010    
IPC:
H01L 21/60 (2006.01), C09J 7/00 (2006.01), C09J 9/00 (2006.01), C09J 11/04 (2006.01), C09J 163/00 (2006.01), H01B 17/56 (2006.01), H05K 3/28 (2006.01), H05K 3/32 (2006.01)
Applicants: Sony Chemical & Information Device Corporation [JP/JP]; Gate City Osaki, East Tower 8th Floor, 11-2, Osaki 1-chome, Shinagawa-ku, Tokyo 1410032 (JP) (For All Designated States Except US).
SATO, Daisuke [JP/JP]; (JP) (For US Only).
NISHIMURA, Junichi [JP/JP]; (JP) (For US Only).
ODAKA, Ryosuke [JP/JP]; (JP) (For US Only)
Inventors: SATO, Daisuke; (JP).
NISHIMURA, Junichi; (JP).
ODAKA, Ryosuke; (JP)
Agent: HIROTA, Koichi; HIROTA, NAGARE & ASSOCIATES, 4th Floor, Shinjuku TR Bldg., 2-2-13, Yoyogi, Shibuya-ku, Tokyo 1510053 (JP)
Priority Data:
2009-139483 10.06.2009 JP
2010-045247 02.03.2010 JP
Title (EN) INSULATING RESIN FILM, BONDED BODY USING INSULATING RESIN FILM, AND METHOD FOR MANUFACTURING BONDED BODY
(FR) FILM DE RÉSINE ISOLANTE, CORPS COLLÉ À L'AIDE DU FILM DE RÉSINE ISOLANTE ET PROCÉDÉ DE FABRICATION DE CORPS COLLÉ
(JA) 絶縁性樹脂フィルム、並びにこれを用いた接合体及びその製造方法
Abstract: front page image
(EN)Provided is an insulating resin film which bonds together a substrate and an electronic component. The insulating resin film has a first adhesive layer disposed on the substrate side, and a second adhesive layer disposed on the electronic component side. The first adhesive layer and the second adhesive layer contain an inorganic filling material, the peak temperature of DSC heat generation of the second adhesive layer is higher than that of DSC heat generation of the first adhesive layer, and the thickness of the first adhesive layer is 50-90% of the total thickness.
(FR)L'invention porte sur un film de résine isolante qui colle l'un à l'autre un substrat un composant électronique. Le film de résine isolante comprend une première couche adhésive disposée côté substrat, et une seconde couche adhésive disposée côté composant électronique. La première couche adhésive et la seconde couche adhésive contiennent un matériau de charge inorganique, la température maximale de génération de chaleur DSC de la seconde couche adhésive est supérieure à celle de la génération de chaleur DSC de la première couche adhésive, et l'épaisseur de la première couche adhésive représente 50-90 % de l'épaisseur totale.
(JA) 基板と電子部品とを接合する絶縁性樹脂フィルムであって、前記基板側に配置される第1の接着剤層と、前記電子部品側に配置される第2の接着剤層とを有し、前記第1の接着剤層及び前記第2の接着剤層は、無機充填材を含有し、前記第2の接着剤層のDSC発熱ピーク温度は、前記第1の接着剤層のDSC発熱ピーク温度よりも高く、前記第1の接着剤層の厚みは、総厚みの50%~90%である絶縁性樹脂フィルムを提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)