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Machine translation
1. (WO2010143132) CRIMP BUMP INTERCONNECTION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/143132    International Application No.:    PCT/IB2010/052536
Publication Date: 16.12.2010 International Filing Date: 08.06.2010
IPC:
H01L 21/60 (2006.01), H01L 23/485 (2006.01), H01L 23/498 (2006.01), H01L 23/00 (2006.01)
Applicants: NXP B.V. [NL/NL]; High Tech Campus 60 NL-5656 AG Eindhoven (NL) (For All Designated States Except US).
PISCHLER, Erich [AT/AT]; (GB) (For US Only)
Inventors: PISCHLER, Erich; (GB)
Agent: WILLIAMSON, Paul, L.; c/o NXP Semiconductors IP Department Betchworth House 57-65 Station Road Redhill Surrey RH1 1DL (GB)
Priority Data:
09162632.5 12.06.2009 EP
Title (EN) CRIMP BUMP INTERCONNECTION
(FR) INTERCONNEXION PAR BOSSAGE À SERTIR
Abstract: front page image
(EN)The invention relates to a first integrated electronic component for an integrated electronic apparatus. The first integrated electronic component (100) comprises a male body (102) with a protrusion element (103). The protrusion element (103) comprises a protrusion connection section (104). The protrusion element (103) protrudes from the male body (102) in such a way that the protrusion connection section (104) is adapted for being mechanically connectable to a corresponding connection recess (202) of a female electrical conductive body (201) of the second integrated electronic component (200).
(FR)L'invention porte sur un premier composant électronique intégré destiné à un appareil électronique intégré. Le premier composant électronique intégré (100) comprend un corps mâle (102) comprenant un élément saillant (103). L'élément saillant (103) comprend une section de raccordement saillante (104). L'élément saillant (103) fait saillie du corps mâle (102) de telle manière que la section de raccordement saillante (104) est conçue pour pouvoir être mécaniquement raccordée à un renfoncement de raccordement correspondant (202) d'un corps conducteur électrique femelle (201) du second composant électronique intégré (200).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)