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Machine translation
1. (WO2010141311) COMPLIANT PRINTED CIRCUIT AREA ARRAY SEMICONDUCTOR DEVICE PACKAGE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/141311    International Application No.:    PCT/US2010/036363
Publication Date: 09.12.2010 International Filing Date: 27.05.2010
IPC:
H01L 23/485 (2006.01), H01L 21/00 (2006.01)
Applicants: HSIO TECHNOLOGIES, LLC [US/US]; 13300 67th Avenue North Maple Grove, Minnesota 55311 (US) (For All Designated States Except US).
RATHBURN, James [US/US]; (US) (For US Only)
Inventors: RATHBURN, James; (US)
Agent: SCHWAPPACH, Karl, G.; Stoel Rives LLP 201 So. Main Street, Suite 1100 Salt Lake City, Utah 84111 (US)
Priority Data:
61/183,411 02.06.2009 US
Title (EN) COMPLIANT PRINTED CIRCUIT AREA ARRAY SEMICONDUCTOR DEVICE PACKAGE
(FR) BOÎTIER DE DISPOSITIF À SEMI-CONDUCTEUR MATRICIEL À CIRCUIT IMPRIMÉ ADAPTABLE
Abstract: front page image
(EN)An integrated circuit (IC) package for an IC device, and a method of making the same. The IC package includes an interconnect assembly with at least one printed compliant layer, a plurality of first contact members located along a first major surface, a plurality of second contact members located along a second major surface, and a plurality of printed conductive traces electrically coupling a plurality of the first and second contact members. The compliant layer is positioned to bias at least the first contact members against terminals on the IC device. Packaging substantially surrounds the IC device and the interconnect assembly. The second contact members are accessible from outside the packaging.
(FR)L'invention concerne un boîtier de circuit intégré (CI) destiné à un dispositif CI, ainsi qu'un procédé de fabrication correspondant. Le boîtier CI comprend un ensemble d'interconnexion présentant au moins une couche adaptable imprimée, une pluralité de premiers éléments de contact situés le long d'une première surface principale, une pluralité de seconds éléments de contact situés le long d'une seconde surface principale, et une pluralité de traces conductrices imprimées couplant électriquement une pluralité des premiers et seconds éléments de contact. La couche adaptable est disposée de manière à solliciter au moins les premiers éléments de contact contre des bornes sur le dispositif CI. Le boîtier entoure sensiblement le dispositif CI et l'ensemble d'interconnexion. Les seconds éléments de contact sont accessibles depuis l'extérieur du boîtier.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)