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1. (WO2010140788) CHEMICAL-MECHANICAL POLISHING SLURRY COMPOSITION COMPRISING NONIONIZED HEAT-ACTIVATED NANOCATALYST, AND POLISHING METHOD USING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/140788    International Application No.:    PCT/KR2010/003349
Publication Date: 09.12.2010 International Filing Date: 27.05.2010
IPC:
C09K 3/14 (2006.01), H01L 21/304 (2006.01)
Applicants: DONGJIN SEMICHEM CO., LTD. [KR/KR]; Gajwa-dong 472-2 Seo-gu Incheon 404-250 (KR) (For All Designated States Except US).
PARK, Jong Dai [KR/KR]; (KR) (For US Only).
LIM, Jin Hyuk [KR/KR]; (KR) (For US Only).
CHOI, Jung Min [KR/KR]; (KR) (For US Only).
KONG, Hyun Goo [KR/KR]; (KR) (For US Only).
KIM, Jae Hyun [KR/KR]; (KR) (For US Only).
PARK, Hye Jung [KR/KR]; (KR) (For US Only)
Inventors: PARK, Jong Dai; (KR).
LIM, Jin Hyuk; (KR).
CHOI, Jung Min; (KR).
KONG, Hyun Goo; (KR).
KIM, Jae Hyun; (KR).
PARK, Hye Jung; (KR)
Agent: YOU ME PATENT AND LAW FIRM; Seolim Bldg. 649-10, Yoksam-dong, Kangnam-ku Seoul 135-080 (KR)
Priority Data:
10-2009-0048187 01.06.2009 KR
10-2009-0074344 12.08.2009 KR
Title (EN) CHEMICAL-MECHANICAL POLISHING SLURRY COMPOSITION COMPRISING NONIONIZED HEAT-ACTIVATED NANOCATALYST, AND POLISHING METHOD USING SAME
(FR) COMPOSITION DE BOUE DE POLISSAGE MÉCANO-CHIMIQUE COMPRENANT UN NANOCATALYSEUR NON IONISÉ ACTIVÉ À CHAUD, ET PROCÉDÉ DE POLISSAGE L'UTILISANT
(KO) 이온화되지 않는 열활성 나노촉매를 포함하는 화학 기계적 연마 슬러리 조성물 및 이를 이용한 연마방법
Abstract: front page image
(EN)The invention relates to a polishing slurry composition which comprises a nonionized heat-activated nanocatalyst, and which is useful for a chemical-mechanical planarization process, and to a polishing method using the composition. The chemical-mechanical polishing slurry composition comprises: a nonionized heat-activated nanocatalyst which discharges electrons and holes by the energy generated during a chemical-mechanical polishing process; an abrasive; and an oxidizing agent. The nonionized heat-activated nanocatalyst and the abrasive are different from each other. Preferably, the nonionized heat-activated nanocatalyst is a semiconductor substance which discharges, in an aqueous solution state, electrons and holes at a temperature of 10 to 100°C. Preferably, transition metal silicide selected from a group consisting of CrSi, MnSi, CoSi, ferrosilicon (FeSi) and a mixture thereof can be used as the nonionized heat-activated nanocatalyst. More preferably, a semiconductor substance such as nanoferrosilicon can be used as the nonionized heat-activated nanocatalyst. The content of the nonionized heat-activated nanocatalyst is 0.00001 to 0.1 wt % with respect to the total slurry composition.
(FR)La présente invention concerne une composition de boue de polissage qui comprend un nanocatalyseur non ionisé activé à chaud, et qui est utile pour un procédé de planarisation mécano-chimique, et un procédé de polissage utilisant la composition. La composition de boue de polissage mécano-chimique comprend : un nanocatalyseur non ionisé activé à chaud qui décharge des électrons et des trous par l'énergie produite durant un procédé de polissage mécano-chimique; un abrasif; et un agent oxydant. Le nanocatalyseur non ionisé activé à chaud et l'abrasif sont différents l'un de l'autre. De préférence, le nanocatalyseur non ionisé activé à chaud est une substance semi-conductrice qui décharge, à l'état de solution aqueuse, des électrons et des trous à une température allant de 10 à 100 °C. De préférence, un siliciure de métaux de transition choisi dans le groupe constitué par CrSi, MnSi, CoSi, ferrosilicium (FeSi) et leur mélange peut être utilisé comme nanocatalyseur non ionisé activé à chaud. De préférence encore, une substance semi-conductrice telle que le nanoferrosilicium peut être utilisée comme nanocatalyseur non ionisé activé à chaud. La teneur en nanocatalyseur non ionisé activé à chaud va de 0,00001 à 0,1 % en poids par rapport à la composition totale de boue.
(KO)이온화되지 않는 열활성 나노촉매를 포함하여, 금속층의 화학 기계적 평탄화 공정에 유용한 연마 슬러리 조성물 및 이를 이용한 연마방법이 개시된다. 상기 화학 기계적 연마 슬러리 조성물은, 화학 기계적 연마 공정에서 발생되는 에너지에 의해서 전자와 정공을 방출시키는 이온화되지 않는 열활성 나노촉매; 연마제; 및 산화제를 포함한다. 상기 이온화되지 않는 열활성 나노촉매와 연마제는 서로 상이하고, 상기 이온화되지 않는 열활성 나노촉매는 수용액 상태에서 10 내지 100 ℃의 온도에서 전자와 정공을 방출시키는 반도체 물질인 것이 바람직하며, 바람직하게는, CrSi, MnSi, CoSi, 페로실리콘(FeSi) 및 이들의 혼합물로 이루어진 군으로부터 선택되는 전이금속실리사이드(transition metal silicide)가 사용될 수 있고, 더욱 바람직하게는, 나노페로실리콘(nano ferrosilicon)과 같은 반도체 물질이 사용될 수 있다. 상기 이온화되지 않는 열활성 나노촉매의 함량은 전체 슬러리 조성물에 대하여 0.00001 내지 0.1 중량%이다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)