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1. (WO2010140635) ORGANIC SILICON COMPOUND, THERMOSETTING COMPOSITION CONTAINING SAID ORGANIC SILICON COMPOUND, AND SEALING MATERIAL FOR OPTICAL SEMICONDUCTOR
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/140635    International Application No.:    PCT/JP2010/059386
Publication Date: 09.12.2010 International Filing Date: 02.06.2010
IPC:
C08G 77/50 (2006.01), C08G 77/12 (2006.01), C08L 83/05 (2006.01), C08L 83/07 (2006.01), C08L 83/14 (2006.01), C09D 183/05 (2006.01), C09D 183/07 (2006.01), C09D 183/14 (2006.01), C09K 3/10 (2006.01), H01L 23/29 (2006.01), H01L 23/31 (2006.01), H01L 33/56 (2010.01)
Applicants: JNC Corporation [JP/JP]; 2-1, Otemachi 2-chome, Chiyoda-ku, Tokyo 1008105 (JP) (For All Designated States Except US).
INOKI Daisuke; (For US Only).
KAWABATA Kiichi; (For US Only).
TAJIMA Akio; (For US Only).
MATSUO Takashi; (For US Only)
Inventors: INOKI Daisuke; .
KAWABATA Kiichi; .
TAJIMA Akio; .
MATSUO Takashi;
Agent: OGURI Shohei; Eikoh Patent Firm, Toranomon East Bldg. 10F, 7-13, Nishi-Shimbashi 1-chome, Minato-ku, Tokyo 1050003 (JP)
Priority Data:
2009-133518 02.06.2009 JP
Title (EN) ORGANIC SILICON COMPOUND, THERMOSETTING COMPOSITION CONTAINING SAID ORGANIC SILICON COMPOUND, AND SEALING MATERIAL FOR OPTICAL SEMICONDUCTOR
(FR) COMPOSÉ ORGANOPOLYSILOXANE, COMPOSITION THERMODURCISSABLE CONTENANT LEDIT COMPOSÉ ORGANOPOLYSILOXANE ET MATÉRIAU D'ÉTANCHÉITÉ POUR SEMI-CONDUCTEUR OPTIQUE
(JA) 有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性組成物、および光半導体用封止材料
Abstract: front page image
(EN)Disclosed is a liquid organic silicon compound containing a structural unit represented by formula (1-a) and a structural unit represented by formula (1-b). In formula (1-a), each symbol R1 independently represents a group selected from cyclopentyls, cyclohexyls and C1-4 alkyls; in formula (1-b), R2 and R3 independently represent groups selected from cyclopentyls, cyclohexyls and C1-4 alkyls, and n is an integer between 2 and 50. Here, if α and β are the mole fractions of each of the structural units in the liquid organic silicon compound, then the ratio between α and n x β (α : n x β) is between 1:3 and 1:100.
(FR)L'invention porte sur un composé organopolysiloxane liquide contenant un motif de structure représenté par la formule (1-a) et un motif de structure représenté par la formule (1-b). Dans la formule (1-a), les symboles R1 représentent des groups choisis indépendamment les uns des autres parmi un cyclopentyle, un cyclohexyle et un alkyle ayant un nombre de carbones égal à 1-4; dans la formule (1-b), R2 et R3 représentent des groupes choisis indépendamment les uns des autres parmi un cyclopentyle, un cyclohexyle et un alkyle ayant un nombre de carbones égal à 1-4 et n est un entier compris entre 2 et 50. Ici, si α et β sont les fractions molaires de chacun des motifs de structure dans le composé organopolysiloxane liquide, alors le rapport entre α et n x β (α:nxβ) est compris entre 1:3 et 1:100.
(JA) 式(1-a)で表される構成単位と、式(1-b)で表される構成単位とを含む液状有機ケイ素化合物。 上記式(1-a)中、Rはそれぞれ独立して、炭素数1~4のアルキル、シクロペンチルおよびシクロヘキシルから選択される基であり、式(1-b)中、R及びRはそれぞれ独立して、炭素数1~4のアルキル、シクロペンチルおよびシクロヘキシルから選択される基であり、nは2~50の整数である。ここで、α、βを、液状有機ケイ素化合物中のそれぞれの構成単位のモル分率とした場合に、αとn×βの比(α:n×β)が1:3~1:100である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)