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1. WO2010140503 - LEAD WIRE CONNECTION APPARATUS AND CONNECTION METHOD FOR SEMICONDUCTOR CELLS

Publication Number WO/2010/140503
Publication Date 09.12.2010
International Application No. PCT/JP2010/058765
International Filing Date 24.05.2010
IPC
H01L 31/042 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
04adapted as photovoltaic conversion devices
042PV modules or arrays of single PV cells
CPC
H01L 21/67132
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67132Apparatus for placing on an insulating substrate, e.g. tape
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 31/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
04adapted as photovoltaic [PV] conversion devices
H01L 31/18
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 31/188
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
1876Particular processes or apparatus for batch treatment of the devices
188Apparatus specially adapted for automatic interconnection of solar cells in a module
Y02E 10/50
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
10Energy generation through renewable energy sources
50Photovoltaic [PV] energy
Applicants
  • 芝浦メカトロニクス株式会社 SHIBAURA MECHATRONICS CORPORATION [JP]/[JP] (AllExceptUS)
  • 安部 光仁 ABE, Mitsuhito [JP]/[JP] (UsOnly)
  • 川崎 朋義 KAWASAKI, Tomoyoshi [JP]/[JP] (UsOnly)
Inventors
  • 安部 光仁 ABE, Mitsuhito
  • 川崎 朋義 KAWASAKI, Tomoyoshi
Agents
  • 鈴江 武彦 SUZUYE, Takehiko
Priority Data
2009-13431203.06.2009JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) LEAD WIRE CONNECTION APPARATUS AND CONNECTION METHOD FOR SEMICONDUCTOR CELLS
(FR) APPAREIL ET PROCÉDÉ DE CONNEXION DE FILS CONDUCTEURS POUR CELLULES À SEMICONDUCTEUR
(JA) 半導体セルのリード線接続装置及び接続方法
Abstract
(EN) Disclosed is an apparatus provided with: a tape attaching means (13) to attach pieces of adhesive conductive tape at one time to the upper and lower faces of each of semiconductor cells supplied from a supply unit (12); a conveyance unit (14) to pitch-feed the semiconductor cells having the conductive tape attached thereon; lead wire process means (15a to 15d) to perform a process of forming lead wire; a temporary bonding means (15), provided in a section facing those of the semiconductor cells that are being pitch-fed, to alternately connect the upper face of each semiconductor cell and the lower face of another semiconductor cell adjacent thereto by holding the formed lead wire, and repeating temporary bonding of the lead wire to the conductive tape provided on the upper and lower faces of the semiconductor cells that are being pitch-fed; and a permanent bonding means (16), arranged in the downstream side of the temporary bonding means in a direction in which the semiconductor cells are fed, to permanently bond at one time each pair of upper and lower pieces of lead wire temporarily bonded on the upper and lower faces of the semiconductor cells.
(FR) L'invention concerne un appareil muni : d'un moyen (13) de fixation de ruban servant à fixer des morceaux de ruban conducteur adhésif un par un aux faces supérieure et inférieure de chacune des cellules à semiconducteur amenées depuis une unité (12) d'alimentation ; d'une unité (14) de convoyage servant à faire avancer pas à pas les cellules à semiconducteur auxquelles est fixé le ruban conducteur ; de moyens (15a à 15d) de traitement du fil conducteur servant à réaliser un processus de formation de fil conducteur ; d'un moyen (15) de collage temporaire, placé dans une section faisant face à celles des cellules à semiconducteur qui avancent pas à pas, afin de connecter alternativement la face supérieure de chaque cellule à semiconducteur à la face inférieure d'une autre cellule à semiconducteur qui lui est adjacente en maintenant le fil conducteur formé, et à répéter le collage temporaire du fil conducteur au ruban conducteur apposé sur les faces supérieure et inférieure des cellules à semiconducteur avançant pas à pas ; et d'un moyen (16) de collage définitif, disposé du côté aval du moyen de collage temporaire dans la direction d'avance des cellules à semiconducteur, servant à coller définitivement une par une chaque paire de morceaux supérieur et inférieur de fil conducteur collés temporairement sur les faces supérieure et inférieure des cellules à semiconducteur.
(JA)  供給部(12)から供給された半導体セルの上面と下面に粘着性の導電性テープを同時に貼着するテープ貼着手段(13)と、導電性テープが貼着された半導体セルをピッチ送りする搬送手段(14)と、リード線を成形加工するリード線加工手段(15a~15d)と、ピッチ送りされる半導体セルと対向する部位に設けられ成形されたリード線を保持してピッチ送りされる半導体セルの上面と下面に設けられた導電性テープにリード線の仮圧着を繰り返して隣り合う半導体セルの上面と下面を交互に接続する仮圧着手段(15)と、仮圧着手段よりも半導体セルの送り方向下流側に配置され半導体セルの上面と下面に仮圧着された上下一対のリード線を同時に本圧着する本圧着手段(16)を具備する。
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