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1. (WO2010138931) MECHANICAL ISOLATION FOR MEMS ELECTRICAL CONTACTS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2010/138931 International Application No.: PCT/US2010/036749
Publication Date: 02.12.2010 International Filing Date: 28.05.2010
IPC:
B81B 7/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
B
MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES
7
Micro-structural systems
Applicants: GUTIERREZ, Roman C.[US/US]; US (UsOnly)
CALVET, Robert J[US/US]; US (UsOnly)
TESSERA MEMS TECHNOLOGIES, INC.[US/US]; 3025 Orchard Parkway San Jose, CA 95134, US (AllExceptUS)
Inventors: GUTIERREZ, Roman C.; US
CALVET, Robert J; US
Agent: HALLMAN, Jon W.; Haynes and Boone LLP 2323 Victory Avenue Suite 700 Dallas, Texas 95219-7673, US
Priority Data:
61/182,29229.05.2009US
Title (EN) MECHANICAL ISOLATION FOR MEMS ELECTRICAL CONTACTS
(FR) ISOLATION MÉCANIQUE POUR CONTACTS ÉLECTRIQUES DE MICROSYSTÈME ÉLECTROMÉCANIQUE
Abstract:
(EN) In accordance with the disclosure, a MEMS substrate is provided that includes: a central planar portion configured to support a MEMS device; and a first electrical pad coplanar with the central planar portion, the first pad being connected to the central planar portion through a first flexure, wherein the first flexure is configured to substantially mechanically isolate the first electrical pad from the central planar portion.
(FR) La présente invention a trait à un substrat de microsystème électromécanique qui inclut : une partie plane centrale configurée de manière à supporter un dispositif de microsystème électromécanique; et une première plage de connexion électrique coplanaire avec la partie plane centrale, la première plage de connexion étant connectée à la partie plane centrale au moyen d'un premier bras souple, lequel premier bras souple est configuré pour isoler de façon sensiblement mécanique la première plage de connexion électrique de la partie plane centrale.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)