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Machine translation
1. (WO2010137793) BAKING DEVICE FOR PREPARING MAGNETIC THIN FILM SENSOR AND METHOD THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/137793    International Application No.:    PCT/KR2010/001390
Publication Date: 02.12.2010 International Filing Date: 05.03.2010
IPC:
H01L 21/027 (2006.01), H01L 21/02 (2006.01)
Applicants: NOVAMAGNETICS CO LTD.COM [KR/KR]; 4 block 5 lot, Namdong Industrial District 618-4, Namchun-dong, Namdong-gu Inchen 405-100 (KR) (For All Designated States Except US).
KIM, Jong Ho [KR/KR]; (KR) (For US Only).
SHIN, Dong Moon [KR/KR]; (KR) (For US Only).
KIM, Ki Hyeon [KR/KR]; (KR) (For US Only)
Inventors: KIM, Jong Ho; (KR).
SHIN, Dong Moon; (KR).
KIM, Ki Hyeon; (KR)
Agent: KIM, Jae Wook; 1510, Yeoksam-heitz, 642-19 Yeoksam-dong, Gangnam-gu Seoul 135-981 (KR)
Priority Data:
10-2009-0045307 25.05.2009 KR
Title (EN) BAKING DEVICE FOR PREPARING MAGNETIC THIN FILM SENSOR AND METHOD THEREOF
(FR) DISPOSITIF DE CUISSON POUR PRÉPARER UN CAPTEUR À COUCHE MINCE MAGNÉTIQUE ET PROCÉDÉ ASSOCIÉ
(KO) 자기박막센서 제조를 위한 베이킹 장치 및 방법
Abstract: front page image
(EN)Provided are a baking device for preparing a magnetic thin film sensor and a method thereof, wherein a wafer top part is heated by the convection of high temperature air, which is heated by a heater positioned at a lower end of a convection chamber capable of being insulated from the outside, the wafer is fixed on a specifically prepared frame (jig) such that the lower part as well as the top part may be uniformly heated, thereby promoting the durability of a photosensitive film itself as well as the adhesion force between the photosensitive film and the surfaces of the wafer, the heater mounted at the lower end part of the chamber is controlled in real time by a control part, which controls the internal temperature of a baking chamber according to a signal output from a temperature sensor, such that the temperature of air in the chamber may be kept uniform so as to uniformly cure the photosensitive film doped on the wafer, thereby improving the yield of the magnetic thin film sensor, workers are protected from burns from a baking plate of high temperature since the baking plate used in conventional devices is no longer required, and the frame to secure the wafer is maximized in the contact area with the wafer for heating the wafer at uniform temperature and increased in heat conductivity since the surfaces of the frame are lapped.
(FR)L'invention concerne un dispositif de cuisson pour préparer un capteur à couche mince magnétique et un procédé associé, selon lequel une partie supérieure de plaquette est chauffée par convection d'air haute température, qui est chauffé par un élément chauffant positionné au niveau d'une extrémité inférieure d'une chambre de convection pouvant être isolée de l'extérieur, la plaquette étant fixée sur un châssis spécifiquement préparé (gabarit) de sorte que la partie inférieure ainsi que la partie supérieure puissent être chauffées uniformément, ce qui permet de favoriser la durabilité d'un film photosensible ainsi que la force d'adhérence entre le film photosensible et les surfaces de la plaquette. L'élément chauffant monté au niveau de la partie d'extrémité inférieure de la chambre est commandé en temps réel par une unité de commande qui régule la température interne d'une chambre de cuisson en fonction d'un signal émis par un capteur de température, de façon que la température de l'air dans la chambre reste uniforme pour cuire uniformément le film photosensible dopé sur la plaquette, ce qui permet d'améliorer le rendement du capteur à couche mince magnétique. Les ouvriers sont ainsi protégés contre les brûlures provoquées par une plaque de cuisson à haute température étant donné que la plaque de cuisson utilisée dans des dispositifs classiques n'est plus nécessaire. De plus, le châssis pour fixer la plaquette présente une zone de contact avec la plaquette maximisée pour chauffer ladite plaquette à une température uniforme et une conductivité thermique améliorée étant donné que les surfaces du châssis sont chevauchantes.
(KO)본 발명인 자기박막센서 제조를 위한 베이킹 장치 및 방법은 외부와 단열이 가능한 대류 챔버를 이용하여 챔버 하단에 위치한 히터를 통해 가열된 고열의 공기 대류에 의해 웨이퍼 상부를 가열하고, 상기 웨이퍼는 특수하게 제작된 틀(Jig) 위에 고정시켜 웨이퍼 상부뿐만이 아니라 하부도 균일하게 가열함으로써, 감광막과 웨이퍼 표면간의 접착력을 증진시킴은 물론 감광막 자체의 내구력을 증진시키고, 온도감지센서의 신호를 통해 베이킹 챔버 내의 온도를 제어하는 제어부에 의해 챔버 하단부에 설치된 히터를 실시간으로 제어함으로써, 챔버 내부의 공기 온도를 균일하게 유지하여 웨이퍼 상에 도포된 감광막을 균일하게 경화시켜 자기박막센서의 제조 수율을 향상시키며, 종래의 장치에서 사용되는 베이킹 플레이트가 필요하지 않기 때문에 고열의 베이킹 플레이트에 의해 작업자가 화상을 입을 우려가 없고, 웨이퍼가 올려지는 틀은 균일한 온도로 웨이퍼를 가열하기 위해 웨이퍼와의 접촉 면적을 최대화시킴은 물론 틀의 표면을 연마(Lapping)하여 열전도율을 높일 수 있는 것이다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)