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Machine translation
1. (WO2010123276) THERMAL FUSE RESISTOR
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/123276    International Application No.:    PCT/KR2010/002498
Publication Date: 28.10.2010 International Filing Date: 21.04.2010
IPC:
H01H 85/048 (2006.01), H01H 85/02 (2006.01)
Applicants: SMART ELECTRONICS INC. [KR/KR]; 1406, Joil-ri, Samdong-myeon, Ulju-gun Ulsan 689-934 (KR) (For All Designated States Except US).
JUNG, Jong Il [KR/KR]; (KR) (For US Only).
KANG, Doo Won [KR/KR]; (KR) (For US Only).
AHN, Gyu Jin [KR/KR]; (KR) (For US Only).
KIM, Sung Kwang [KR/KR]; (KR) (For US Only).
LEE, Kyung Mi [KR/KR]; (KR) (For US Only)
Inventors: JUNG, Jong Il; (KR).
KANG, Doo Won; (KR).
AHN, Gyu Jin; (KR).
KIM, Sung Kwang; (KR).
LEE, Kyung Mi; (KR)
Agent: SEO, Bong Seok; 3rd fl., Myung-Ji B/D 1572-12, Seocho-dong Seocho-ku Seoul 137-874 (KR)
Priority Data:
10-2009-0034669 21.04.2009 KR
Title (EN) THERMAL FUSE RESISTOR
(FR) RÉSISTANCE-FUSIBLE THERMIQUE
Abstract: front page image
(EN)Disclosed is a fuse resistor representing superior manufacturing efficiency and assembling reliability. The fuse resistor includes a resistor, a thermal fuse that is disconnected by heat generated from the resistor, and a case receiving the resistor and the thermal fuse therein and having a space section for transferring radiant heat of the resistor to the thermal fuse. Fillers are not required so that the manufacturing process is simplified. Since the assembling process is completed by covering a body of the case with a cap after the resistor and the thermal fuse have been inserted into the body, the manufacturing efficiency is improved.
(FR)L'invention concerne une résistance-fusible présentant un rendement de fabrication et une fiabilité de montage améliorés. Cette résistance-fusible comprend une résistance, un fusible thermique isolé de la chaleur générée par la résistance, et un boîtier destiné à contenir la résistance et le fusible thermique, comportant un espace pour le transfert de la chaleur par rayonnement émise par la résistance au fusible thermique. Aucune matière de remplissage n'est requise, ce qui simplifie le processus de fabrication. Du fait que le processus d'assemblage consiste à fermer le corps de boîtier avec un couvercle après que la résistance et le fusible ont été insérés dans le corps, on obtient un rendement de fabrication accru.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)