WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2010123162) PROCESS FOR FORMATION OF HIERARCHICAL MICROSTRUCTURE USING PARTIAL CURING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/123162    International Application No.:    PCT/KR2009/002052
Publication Date: 28.10.2010 International Filing Date: 20.04.2009
IPC:
H01L 21/027 (2006.01), B82B 3/00 (2006.01)
Applicants: SNU R&DB FOUNDATION [KR/KR]; San 56-1 Sillim-dong, Gwanak-gu Seoul 151-010 (KR) (For All Designated States Except US).
SUH, Kahp Yang [KR/KR]; (KR) (For US Only).
JEONG, Hoon Eui [KR/KR]; (KR) (For US Only).
KAWK, No Kyun [KR/KR]; (KR) (For US Only)
Inventors: SUH, Kahp Yang; (KR).
JEONG, Hoon Eui; (KR).
KAWK, No Kyun; (KR)
Agent: LEE, Jong Hyuk; 7th Fl., Heungkuk Life Insurance Bldg. 814-5, Yeoksam-dong, Gangnam-gu Seoul 135-931 (KR)
Priority Data:
Title (EN) PROCESS FOR FORMATION OF HIERARCHICAL MICROSTRUCTURE USING PARTIAL CURING
(FR) PROCÉDÉ DE FORMATION DE MICROSTRUCTURE HIÉRARCHISÉE, PAR DURCISSEMENT PARTIEL
(KO) 부분경화를 이용한 계층적 미세 구조물 형성방법
Abstract: front page image
(EN)Disclosed is a simplified process for formation of a hierarchical microstructure having no heterogeneous interface using partial curing. To achieve the above, provided is a process for the formation of a hierarchical microstructure using partial curing which comprises the steps of: forming a first polymer pattern having a partial curing layer; and forming a second polymer pattern on the first polymer pattern using said partial curing layer. According to the present invention, the formation of a microstructure having various hierarchical structures can be simplified. Therefore, the productivity and economic efficiency of various processes which require the formation of a microstructure having various hierarchical structures can be enhanced. In addition, a new functional material can be developed, which has not only a super hydrophobic surface but also high adhesiveness even on rough surfaces.
(FR)La présente invention concerne un procédé simplifié de réalisation, par durcissement partiel, d'une microstructure hiérarchisée exempte d'interface hétérogène. L'invention concerne plus particulièrement un procédé de réalisation, par durcissement partiel, d'une microstructure hiérarchisée comprenant les étapes suivantes: réalisation d'un premier motif polymère à couche de durcissement partiel; puis, réalisation d'un second motif polymère sur le premier motif polymère au moyen de ladite couche de durcissement partiel. La présente invention permet ainsi de simplifier la réalisation d'une microstructure comportant diverses structures hiérarchisées. Il en résulte une meilleure productivité et un meilleur rendement économique des divers traitements qui demandent la réalisation d'une microstructure présentant diverses structures hiérarchisées. En outre, il est ainsi possible de mettre au point un nouveau matériau fonctionnel se distinguant, non seulement par une surface super-hydrophobe, mais aussi par une adhésivité élevée, même sur des surfaces rugueuses.
(KO)제조공정이 간단할 뿐만 아니라, 이종의 계면이 없는 계층구조를 형성할 수 있는 부분경화를 이용한 계층적 미세 구조물의 형성방법이 개시되어 있다. 이를 위하여 부분 경화층을 가지는 제 1 고분자 패턴을 형성하고, 제 1 고분자 패턴 상에 상기 부분 경화층을 이용하여 제 2 고분자 패턴을 형성하는 단계를 포함하는 부분경화를 이용한 계층적 미세 구조물 형성방법을 제공한다. 본 발명에 의하면, 다양한 계층구조를 가지는 미세 구조물을 간단한 공정을 사용하여 형성할 수 있다. 따라서 다양한 계층구조의 미세 구조물의 형성이 필요한 각종 공정의 효율성과 경제성을 향상시킬 수 있다. 또한, 초소수성을 가질 뿐만 아니라 및 거친 표면에서도 고접착성을 가지는 새로운 기능성 소재를 개발할 수 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)