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1. (WO2010122768) THIOL GROUP-CONTAINING ADHESIVE RESIN COMPOSITION

Pub. No.:    WO/2010/122768    International Application No.:    PCT/JP2010/002818
Publication Date: Fri Oct 29 01:59:59 CEST 2010 International Filing Date: Tue Apr 20 01:59:59 CEST 2010
IPC: C09J 4/02
C09J 175/14
Applicants: BRIDGESTONE CORPORATION
株式会社ブリヂストン
KITANO, Hajime
北野 創
AKAMA, Shuyou
赤間 秀洋
Inventors: KITANO, Hajime
北野 創
AKAMA, Shuyou
赤間 秀洋
Title: THIOL GROUP-CONTAINING ADHESIVE RESIN COMPOSITION
Abstract:
Disclosed is a photocurable adhesive resin composition, which exhibits excellent adhesion not only to thermoplastic resins such as PET and polyimide, but also to objects to be bonded, which are formed from metal oxides such as IZO or metals such as gold. Specifically disclosed is a thiol group-containing adhesive resin composition which contains (A) a urethane (meth)acrylate oligomer having a weight average molecular weight (Mw) of 5,000-40,000, (B) a (meth)acryloyl morpholine monomer, (C) a polythiol, and (D) a photopolymerization initiator. The thiol group-containing adhesive resin composition is characterized in that the thiol groups contained in the polythiol (C) is in an amount of not less than 0.4 equivalent per 1 equivalent of the total (meth)acrylate groups contained in the thiol group-containing adhesive resin composition.