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1. (WO2010122015) METHOD FOR MAKING A CAVITY IN THE BODY OF A SUBSTRATE CAPABLE OF FORMING A SITE FOR RECEIVING A COMPONENT
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2010/122015 International Application No.: PCT/EP2010/055185
Publication Date: 28.10.2010 International Filing Date: 20.04.2010
Chapter 2 Demand Filed: 13.07.2010
IPC:
B81C 1/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
C
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
1
Manufacture or treatment of devices or systems in or on a substrate
Applicants:
SAINT-PATRICE, Damien [FR/FR]; FR (UsOnly)
BOLIS, Sébastien [FR/FR]; FR (UsOnly)
JACQUET, Fabrice [FR/FR]; FR (UsOnly)
COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES [FR/FR]; 25 rue Leblanc, Bâtiment "Le Ponant D" F-75015 Paris, FR (AllExceptUS)
Inventors:
SAINT-PATRICE, Damien; FR
BOLIS, Sébastien; FR
JACQUET, Fabrice; FR
Agent:
ILGART, Jean-Christophe; Brevalex 95, rue d'Amsterdam F-75378 Paris Cedex 8, FR
Priority Data:
095259821.04.2009FR
Title (EN) METHOD FOR MAKING A CAVITY IN THE BODY OF A SUBSTRATE CAPABLE OF FORMING A SITE FOR RECEIVING A COMPONENT
(FR) PROCEDE DE REALISATION D'UNE CAVITE DANS L'EPAISSEUR D'UN SUBSTRAT POUVANT FORMER UN SITE D'ACCUEIL DE COMPOSANT
Abstract:
(EN) The invention relates to a method for manufacturing a micro-device provided with at least one site for receiving components, formed in the body of a substrate (100, 200), said method including the steps of: a) making, in at least one first substrate (100) adhered to a second substrate (200) by means of a discontinuous gluing interface, at least one first cut (105) around at least one sacrificial block (107) of the first substrate (100), by engraving the first substrate (100) so as to expose said gluing interface; b) removing said sacrificial block (107) so as to make at least one first cavity in the first substrate (100).
(FR) Procédé de réalisation d'un microdispositif doté d'au moins un site d'accueil (de composants, formé dans l'épaisseur d'un substrat (100, 200), le procédé comprenant des étapes de: a) réalisation dans au moins un premier substrat (100) collé à un deuxième substrat (200) par l'intermédiaire d'une interface de collage discontinue, d'au moins une première tranchée (105) autour d'au moins un bloc sacrificiel (107) du premier substrat (100), par gravure du premier substrat (100) de manière à dévoiler ladite interface de collage; b) retrait dudit bloc sacrificiel (107) de façon à réaliser au moins une première cavité dans le premier substrat (100).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: French (FR)
Filing Language: French (FR)