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1. (WO2010121112) METHOD AND APPARATUS FOR RESIDUE DETECTION IN THE EDGE DELETED AREA OF A SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2010/121112 International Application No.: PCT/US2010/031364
Publication Date: 21.10.2010 International Filing Date: 16.04.2010
IPC:
G01N 21/88 (2006.01) ,G01N 21/47 (2006.01) ,G01B 11/06 (2006.01) ,G01B 11/30 (2006.01) ,H01L 21/67 (2006.01)
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21
Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible, or ultra-violet light
84
Systems specially adapted for particular applications
88
Investigating the presence of flaws, defects or contamination
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21
Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible, or ultra-violet light
17
Systems in which incident light is modified in accordance with the properties of the material investigated
47
Scattering, i.e. diffuse reflection
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11
Measuring arrangements characterised by the use of optical means
02
for measuring length, width, or thickness
06
for measuring thickness
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11
Measuring arrangements characterised by the use of optical means
30
for measuring roughness or irregularity of surfaces
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Applicants: TSAI, Kenneth Chien-Quen[US/US]; US (UsOnly)
SCHLEZINGER, Asaf[IL/US]; US (UsOnly)
APPLIED MATERIALS, INC.[US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US (AllExceptUS)
Inventors: TSAI, Kenneth Chien-Quen; US
SCHLEZINGER, Asaf; US
Agent: SERVILLA, Scott S.; Diehl Servilla LLC 33 Wood Ave South Second Floor, Suite 210 Iselin, NJ 08830, US
Priority Data:
12/425,80617.04.2009US
Title (EN) METHOD AND APPARATUS FOR RESIDUE DETECTION IN THE EDGE DELETED AREA OF A SUBSTRATE
(FR) PROCÉDÉ ET APPAREIL DE DÉTECTION DE RÉSIDUS DANS LA ZONE À BORDS SUPPRIMÉS D'UN SUBSTRAT
Abstract:
(EN) Apparatus and methods for detecting residue on a glass substrate and method of use are disclosed. The apparatus comprises a substrate support, a sensor, a controller and a peripheral device in communication with the controller. The apparatus measures the height or thickness of a main surface and an edge delete surface of a substrate to determine if film residue is present on the edge delete surface.
(FR) Cette invention concerne un appareil et des procédés de détection de résidus sur un substrat en verre et son procédé d'utilisation. L'appareil comprend un support de substrat, un capteur, un système de contrôle et un dispositif périphérique en communication avec le système de contrôle. L'appareil mesure la hauteur ou l'épaisseur d'une surface principale et d'une zone à bords supprimés d'un substrat pour déterminer la présence de résidus de film sur la zone à bords supprimés.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)