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1. (WO2010121029) CYCLIC SELF-LIMITING CMP REMOVAL AND ASSOCIATED PROCESSING TOOL
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2010/121029 International Application No.: PCT/US2010/031246
Publication Date: 21.10.2010 International Filing Date: 15.04.2010
IPC:
H01L 21/304 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
SINMAT, INC. [US/US]; 2153 SE Hawthorne Road, Suite 124 Gainesville, FL 32641, US (AllExceptUS)
University of Florida Research Foundation, Inc. [US/US]; US (AllExceptUS)
Inventors:
SINGH, Rajiv, K.; US
SINGH, Deepika; US
MISHRA, Abhudaya; US
Agent:
JETTER, Neil, R.; Jetter & Associates, P.A. 8295 North Military Trail, Suite F Palm Beach Gardens, FL 33410, US
Priority Data:
61/169,55115.04.2009US
Title (EN) CYCLIC SELF-LIMITING CMP REMOVAL AND ASSOCIATED PROCESSING TOOL
(FR) RETRAIT CMP CYCLIQUE AUTO-LIMITATIF ET OUTIL DE TRAITEMENT ASSOCIÉ
Abstract:
(EN) A cyclic method of chemical mechanical polishing (CMP) a wafer having a surface includes placing the wafer on a platen in a CMP apparatus and then performing a multi-step CMP comprising process. The multi-step CMP process includes delivering a first chemical composition onto the wafer while on the platen for a first time duration, and without removing the wafer from the platen, delivering a second chemical composition different from the first composition onto the wafer for a second time duration after the first time duration. The multi-step CMP comprising process includes CMP removal using a slurry during one of the first and second time durations and a non-polishing process during the other of the first and second time durations. The multi-step CMP comprising process is repeated a plurality of times.
(FR) Un procédé cyclique de polissage chimico-mécanique (CMP) d'une plaquette comportant une surface comprend la mise en place de la plaquette sur une platine dans un appareil de CMP puis la réalisation d'un processus comprenant un CMP en plusieurs étapes. Le processus CMP en plusieurs étapes comprend la distribution d'une première composition chimique sur la plaquette tandis que cette dernière se trouve sur la platine pendant une première durée, et sans retirer la plaquette de la platine, la distribution d'une seconde composition chimique différente de la première composition sur la plaquette pendant une seconde durée après la première durée. Le processus comprenant un CMP en plusieurs étapes comprend le retrait CMP à l'aide d'une suspension pendant la première ou seconde durée et un processus de non-polissage pendant l'autre durée. Le processus comprenant un CMP en plusieurs étapes est répété plusieurs fois.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)