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1. (WO2010120473) CONDUCTIVE BUMPS, WIRE LOOPS, AND METHODS OF FORMING THE SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2010/120473 International Application No.: PCT/US2010/028824
Publication Date: 21.10.2010 International Filing Date: 26.03.2010
IPC:
H01L 21/60 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Applicants:
GILLOTTI, Gary, S. [US/US]; US (UsOnly)
KULICKE AND SOFFA INDUSTRIES, INC. [US/US]; 1005 Virginia Drive Fort Washington, PA 19034, US (AllExceptUS)
Inventors:
GILLOTTI, Gary, S.; US
Agent:
SPLETZER, Christopher, M.; Kulicke And Soffa Industries, Inc. 1005 Virginia Drive Fort Washington, PA 19034, US
Priority Data:
61/165,67901.04.2009US
Title (EN) CONDUCTIVE BUMPS, WIRE LOOPS, AND METHODS OF FORMING THE SAME
(FR) BOSSES CONDUCTRICES, BOUCLES DE FIL, ET LEURS PROCÉDÉS DE FORMATION
Abstract:
(EN) A method of forming a conductive bump is provided. The method includes the steps of: (1) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball; (2) raising the bonding tool to a desired height, with a wire clamp open, while paying out wire continuous with the bonded ball; (3) closing the wire clamp; (4) lowering the bonding tool to a smoothing height with the wire clamp still closed; (5) smoothing an upper surface of the bonded ball, with the wire clamp still closed, using the bonding tool; and (6) raising the bonding tool, with the wire clamp still closed, to separate the bonded ball from wire engaged with the bonding tool.
(FR) La présente invention se rapporte à un procédé de formation d'une bosse conductrice. Le procédé comprend les étapes consistant à : (1) lier une bille d'air libre sur un emplacement de liaison à l'aide d'un outil de liaison afin de former une bille liée ; (2) élever l'outil de liaison à une hauteur souhaitée, à l'aide d'un serre-fil ouvert, tout en laissant filer le fil dans la continuité de la bille liée ; (3) fermer le serre-fil ; (4) abaisser l'outil de liaison à une hauteur de lissage, le serre-fil étant toujours fermé ; (5) lisser une surface supérieure de la bille liée, le serre-fil étant toujours fermé, à l'aide de l'outil de liaison ; et (6) élever l'outil de liaison, le serre-fil étant toujours fermé, afin de séparer la bille liée du fil en prise avec l'outil de liaison.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)