Search International and National Patent Collections

1. (WO2010120158) ELECTROPLATING APPARATUS

Pub. No.:    WO/2010/120158    International Application No.:    PCT/KR2010/002425
Publication Date: Fri Oct 22 01:59:59 CEST 2010 International Filing Date: Tue Apr 20 01:59:59 CEST 2010
IPC: C25D 5/02
C25D 17/00
C25D 21/06
C25D 17/10
C25D 17/06
Applicants: KMW INC.
주식회사 케이엠더블유
KIM, Duk-Yong
김덕용
KIM, Sang-Yong
김상용
SEO, Bong-Won
서봉원
Inventors: KIM, Duk-Yong
김덕용
KIM, Sang-Yong
김상용
SEO, Bong-Won
서봉원
Title: ELECTROPLATING APPARATUS
Abstract:
The present invention relates to an electroplating apparatus which comprises: a plating vessel containing electrolyte solution; and a supply unit which is connected to the plating vessel and which sprays the electrolyte solution containing metallic ions for electroplating onto specific parts of the object to be plated, wherein said supply unit is connected to an anode, and the object to be plated is connected to a cathode.