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1. (WO2010120128) METHOD FOR MANUFACTURING A POLISHING RETAINER RING AND RETAINER RING MANUFACTURED THEREBY
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2010/120128 International Application No.: PCT/KR2010/002339
Publication Date: 21.10.2010 International Filing Date: 15.04.2010
IPC:
B24D 7/06 (2006.01) ,H01L 21/304 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
D
TOOLS FOR GRINDING, BUFFING OR SHARPENING
7
Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
06
with inserted abrasive blocks, e.g. segmental
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
황정호 HWANG, Jung Ho [KR/KR]; KR (UsOnly)
(주)아이에스테크노 IS TECHNO.CO., LTD [KR/KR]; 경기도 광주시 오포읍 추자리 366-64 366-64 Chuja-ri Opo-eup Gwangju-si Gyeonggi-do 464-893, KR (AllExceptUS)
Inventors:
황정호 HWANG, Jung Ho; KR
Agent:
윤여표 YOON, Yeopyo; 서울 서울 강남구 논현동 52-8 풍원빌딩 5층 웰 인터내셔널 WELL International 5 floor, Pungwon building 52-8 Nonhyeon-dong, Gangnam-gu Seoul 135-010, KR
Priority Data:
10-2009-003280915.04.2009KR
Title (EN) METHOD FOR MANUFACTURING A POLISHING RETAINER RING AND RETAINER RING MANUFACTURED THEREBY
(FR) PROCÉDÉ DE FABRICATION D'UN ANNEAU DE RETENUE DE POLISSAGE ET ANNEAU DE RETENUE FABRIQUÉ SELON CE PROCÉDÉ
(KO) 연마용 리테이너링의 제조방법 및 그에 따라 제조된 리테이너링
Abstract:
(EN) The present invention relates to a method for manufacturing a polishing retainer ring and a retainer ring manufactured thereby to omit the work of forming slits by attaching a polishing element divided into individual sections, thereby simplifying the work process. The method for manufacturing a polishing retainer ring for polishing a semiconductor element according to the present invention comprises: a first step of smoothly machining a top surface of a ring-shaped parent material; a second step of preparing a plurality of polishing element units by machining a polishing element to be identical with the top shape of the parent material; and a third step of adhering the prepared polishing element unit onto the top surface of the parent material, wherein the respective polishing element units are adhered to be apart from each other at a uniform interval. A retainer ring for polishing a semiconductor element may be manufactured by the method for manufacturing a polishing retainer ring as above, wherein the polishing retainer ring is formed of a polishing element adhered to the top of the parent material and the polishing element is characterized in that a plurality of polishing element units are adhered at a uniform interval to form grooves.
(FR) La présente invention concerne un procédé de fabrication d'un anneau de retenue de polissage, et un anneau de retenue fabriqué selon ce procédé, lequel consiste à exclure la formation de fentes en fixant un élément de polissage divisé en sections individuelles, ce qui simplifie le processus de fabrication. Le procédé de fabrication d'un anneau de retenue de polissage destiné à polir un élément à semi-conducteurs comprend : une première étape d'usinage en douceur d'une surface supérieure d'un matériau parent en forme d'anneau; une deuxième étape de préparation d'une pluralité d'unités d'élément de polissage par usinage d'un élément de polissage devant être identique à la forme supérieure du matériau parent; et une troisième étape de fixation par adhésion de l'unité de l'élément de polissage préparée, sur la surface supérieure du matériau parent, les unités d'élément de polissage respectives étant fixées par adhésion à l'écart les unes des autres et à intervalles réguliers. Un anneau de retenue destiné au polissage d'un élément à semi-conducteurs peut être fabriqué selon le procédé de fabrication d'un anneau de retenue de polissage précité, procédé au cours duquel l'anneau de retenue de polissage est constitué d'un élément de polissage collé sur le dessus du matériau parent, et l'élément de polissage est caractérisé en ce qu'une pluralité d'unités d'élément de polissage sont fixées par adhésion, à intervalles réguliers, de façon à former des rainures.
(KO) 본 발명은 연마재를 분리형으로 부착함으로써 슬릿을 형성하는 작업을 생략할 수 있어 작업공정이 단순화될 수 있도록 한 연마용 리테이너링의 제조방법 및 그에 따라 제조된 리테이너링에 관한 것이다. 본 발명에 따른 연마용 리테이너링의 제조방법은 반도체 소자를 연마하기 위한 연마용 리테이너링의 제조방법에 있어서, 링 형상의 모재의 상면을 매끄럽게 가공하는 1단계; 연마재를 상기 모재의 상면 형상과 일체되도록 가공하여 단수의 연마재단위체를 제작하는 2단계; 상기 제작된 연마재 단위체를 상기 모재의 상면에 접착시켜 고정시키되, 각 연마재 단위체가 일정 간격으로 이격되도록 접착시키는 3단계를 포함한다. 상기 제조방법에 의해 모재의 상부에 부착된 연마재로 구성되며, 상ㄱ 연마재는 다수의 연마재 단위체가 일정한 간격으로 이격되게 부착되어 홈이 형성되도록 한 것을 특징으로 하는 반도체 소자를 연마하기 위한 연마용 리테이너링을 제조할 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)