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1. (WO2010119908) POLYIMIDE FILM FOR METALLIZING, METHOD FOR PRODUCING SAME, AND METAL-LAMINATED POLYIMIDE FILM

Pub. No.:    WO/2010/119908    International Application No.:    PCT/JP2010/056716
Publication Date: Fri Oct 22 01:59:59 CEST 2010 International Filing Date: Thu Apr 15 01:59:59 CEST 2010
IPC: B32B 27/34
B05D 7/02
B05D 7/24
B29C 55/02
B32B 15/088
C08G 73/10
C25D 7/00
B29K 79/00
Applicants: UBE INDUSTRIES, LTD.
宇部興産株式会社
MATSUMOTO, Naoyuki
松本 直行
MII, Hidenori
三井 秀則
UEKIDO, Takeshi
上木戸 健
IIZUMI, Nobu
飯泉 暢
YANAGIDA, Keiichi
柳田 圭一
MASUI, Eiji
升井 英治
NISHINO, Toshiyuki
西野 敏之
MIYAMOTO, Takao
宮本 貴男
Inventors: MATSUMOTO, Naoyuki
松本 直行
MII, Hidenori
三井 秀則
UEKIDO, Takeshi
上木戸 健
IIZUMI, Nobu
飯泉 暢
YANAGIDA, Keiichi
柳田 圭一
MASUI, Eiji
升井 英治
NISHINO, Toshiyuki
西野 敏之
MIYAMOTO, Takao
宮本 貴男
Title: POLYIMIDE FILM FOR METALLIZING, METHOD FOR PRODUCING SAME, AND METAL-LAMINATED POLYIMIDE FILM
Abstract:
Disclosed is a polyimide film for metallizing, which has an anisotropic thermal expansion coefficient and is obtained by laminating a polyimide layer (a) on one or both surfaces of a polyimide layer (b). The polyimide film for metallizing is characterized in that the polyimide layer (b) is formed from a polyimide that is obtained from an acid component containing 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and a diamine component containing p-phenylenediamine, and that the polyimide layer (a) is formed from a polyimide that is obtained from a monomer component containing at least one diamine selected from phenylenediamine and diamino diphenyl ethers. The polyimide film for metallizing is also characterized by containing a surface treatment agent.