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1. (WO2010118183) LOW STRESS-INDUCING HEAT SINK

Pub. No.:    WO/2010/118183    International Application No.:    PCT/US2010/030307
Publication Date: Fri Oct 15 01:59:59 CEST 2010 International Filing Date: Thu Apr 08 01:59:59 CEST 2010
IPC: H05K 7/20
H01L 23/34
G06F 1/20
Applicants: NS ACQUISITION LLC
CARBONE, Mark
CORRALES, Eugenia
MORELAND, Anthony
Inventors: CARBONE, Mark
CORRALES, Eugenia
MORELAND, Anthony
Title: LOW STRESS-INDUCING HEAT SINK
Abstract:
A low stress-inducing heat sink may reduce thermally induced stress and strain in the heat source. The low stress-inducing heat sink may be made of materials with low thermal conductivity. The heat sink may have in-plane flexibility and hence reduce thermally induced stress and strain generated in the heat source and at the interface of the heat sink and the heat source.