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Machine translation
1. (WO2010118183) LOW STRESS-INDUCING HEAT SINK
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/118183    International Application No.:    PCT/US2010/030307
Publication Date: 14.10.2010 International Filing Date: 07.04.2010
IPC:
H05K 7/20 (2006.01), H01L 23/34 (2006.01), G06F 1/20 (2006.01)
Applicants: NS ACQUISITION LLC [US/US]; 453 Ravendale Drive, Suite E Mountain View, California 94043 (US) (For All Designated States Except US).
CARBONE, Mark [US/US]; (US) (For US Only).
CORRALES, Eugenia [US/US]; (US) (For US Only).
MORELAND, Anthony [US/US]; (US) (For US Only)
Inventors: CARBONE, Mark; (US).
CORRALES, Eugenia; (US).
MORELAND, Anthony; (US)
Agent: MUELLER, Heather; The Mueller Law Office, P.C. 12951 Harwick Lane San Diego, California 92130 (US)
Priority Data:
61/167,685 08.04.2009 US
Title (EN) LOW STRESS-INDUCING HEAT SINK
(FR) PUITS DE CHALEUR INDUISANT UNE FAIBLE CONTRAINTE
Abstract: front page image
(EN)A low stress-inducing heat sink may reduce thermally induced stress and strain in the heat source. The low stress-inducing heat sink may be made of materials with low thermal conductivity. The heat sink may have in-plane flexibility and hence reduce thermally induced stress and strain generated in the heat source and at the interface of the heat sink and the heat source.
(FR)La présente invention concerne un puits de chaleur induisant une faible contrainte, pouvant réduire les contraintes et déformations induites thermiquement dans la source de chaleur. Le puits de chaleur induisant une faible contrainte peut être fait de matériaux à faible conductivité thermique. Le puits de chaleur peut présenter de la souplesse dans le plan, et ainsi réduire les contraintes et déformations induites thermiquement, générées dans la source de chaleur et à l'interface du puits de chaleur et de la source de chaleur.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)