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1. (WO2010117876) TOUCH SENSOR WITH MODULAR SENSING COMPONENTS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2010/117876 International Application No.: PCT/US2010/029635
Publication Date: 14.10.2010 International Filing Date: 01.04.2010
IPC:
G06F 3/043 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
041
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
043
using propagating acoustic waves
Applicants:
3M INNOVATIVE PROPERTIES COMPANY [US/US]; 3M Center Post Office Box 33427 Saint Paul, Minnesota 55133-3427, US (AllExceptUS)
Inventors:
ST. PIERRE, Richard, L.; US
Agent:
BERN, Steven, A.; 3M Center Office of Intellectual Property Counsel Post Office Box 33427 Saint Paul, Minnesota 55133-3427, US
Priority Data:
61/167,02706.04.2009US
Title (EN) TOUCH SENSOR WITH MODULAR SENSING COMPONENTS
(FR) CAPTEUR TACTILE AVEC COMPOSANTS DE DÉTECTION MODULAIRES
Abstract:
(EN) A bending wave-type touch sensor for resolving contacts to a substrate, the touch sensor comprised of a plurality of sensor boards coupled to the substrate.
(FR) L'invention concerne un capteur tactile du type à onde de flexion permettant de résoudre des contacts avec un substrat, le capteur tactile étant constitué d'une pluralité de cartes de capteurs reliées au substrat.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)