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Machine translation
1. (WO2010117229) METHOD FOR ARRANGING FINE PARTICLES ON SUBSTRATE BY PHYSICAL PRESSURE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/117229    International Application No.:    PCT/KR2010/002181
Publication Date: 14.10.2010 International Filing Date: 09.04.2010
IPC:
B82B 3/00 (2006.01)
Applicants: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION SOGANG UNIVERSITY [KR/KR]; 1 Sinsu-dong, Mapo-gu Seoul 121-742 (KR) (For All Designated States Except US).
YOON, Kyung Byung [KR/KR]; (KR) (For US Only).
NGUYEN, Nguyen Khanh [VN/KR]; (KR) (For US Only).
PHAM, Cao Thanh Tung [VN/KR]; (KR) (For US Only)
Inventors: YOON, Kyung Byung; (KR).
NGUYEN, Nguyen Khanh; (KR).
PHAM, Cao Thanh Tung; (KR)
Agent: HAM, Hyun-Kyung; 14F., Kukdong Building, 60-1 Chungmuro3-ka, Chung-ku Seoul 100-705 (KR)
Priority Data:
10-2009-0030647 09.04.2009 KR
Title (EN) METHOD FOR ARRANGING FINE PARTICLES ON SUBSTRATE BY PHYSICAL PRESSURE
(FR) PROCÉDÉ DE DISPOSITION DE PARTICULES FINES SUR UN SUBSTRAT AU MOYEN D'UNE PRESSION PHYSIQUE
(KO) 물리적 압력에 의해 미립자를 기재 상에 배치시키는 방법
Abstract: front page image
(EN)The present invention provides a method for arranging fine particles on a substrate, comprising: the first step of preparing a first template on the surface of which a first intaglio or a first relief capable of fixing the location and/or alignment of one or two or more fine particles is formed; and the second step of placing a plurality of fine particles on the first template, and inserting some or all of the fine particles into the pore formed through the first intaglio or the first relief by physical pressure. Furthermore, the present invention provides a method for arranging fine particles on a substrate, comprising: the first step of preparing a first template of which at least a portion of surface is sticky; and the second step of placing two or more fine particles which are composed of only continuous curved surfaces without flat facets on the sticky surface of the first template, and arranging the fine particles on the first template by physical pressure.
(FR)L'invention concerne un procédé de disposition de particules fines sur un substrat, consistant à préparer un premier modèle dont la surface porte une première intaille ou un premier relief capable de fixer la position et/ou l'alignement d'une ou deux particules; et à placer une pluralité de particules fines sur le premier modèle et à insérer une partie ou l'ensemble des particules fines dans les pores formés par la première intaille ou le premier relief par pression physique. L'invention concerne également un procédé de disposition de particules fines sur un substrat, consistant à préparer un premier modèle dont au moins une partie de la surface est adhésive; et à placer au moins deux particules fines uniquement composées de surfaces courbes continues, sans facettes plates, sur la surface adhésive du premier modèle, et à disposer les particules fines sur le premier modèle par pression physique.
(KO)본 발명은 1개 또는 2개 이상의 미립자의 위치 및/또는 배향을 고정시킬 수 있는 제1 음각 또는 제1 양각이 표면에 형성된 제1 기재를 준비하는 제1 단계; 및 상기 제1 기재 상에, 다수의 미립자를 올린 후 물리적 압력에 의해 미립자 일부 또는 전부를 제1음각 또는 제1양각에 의해 형성된 공극(孔隙)에 삽입시키는 제2 단계를 포함하여, 미립자를 기재 상에 배치시키는 방법을 제공한다. 또한, 본 발명은 적어도 표면 일부가 점착성을 띠는 제1 기재를 준비하는 제1 단계; 및 평편한 면(flat facet) 없이 연속적인 곡면으로만 형상이 이루어진 2이상의 다수의 미립자들을 상기 제1 기재 중 점착성을 띠는 표면 상에 올린 후 물리적 압력에 의해 제1 기재 상에 정렬시키는 제2 단계를 포함하여, 미립자를 기재 상에 배치시키는 방법을 제공한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)