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Machine translation
1. (WO2010117098) METHOD OF PREPARING A HEAT-RESISTANT POLYAMIDE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/117098    International Application No.:    PCT/KR2009/001857
Publication Date: 14.10.2010 International Filing Date: 10.04.2009
IPC:
C08G 69/28 (2006.01)
Applicants: SK CHEMICALS CO., LTD. [KR/KR]; 600, Jeongja 1-dong, Jangan-ku, Suwon-city, Kyungki-do, 440-301 (KR) (For All Designated States Except US).
HWANG, Dong-June [KR/KR]; (KR) (For US Only).
LIM, Jae-Bong [KR/KR]; (KR) (For US Only).
LEEM, Seung-Do [KR/KR]; (KR) (For US Only).
KIM, Tae-Young [KR/KR]; (KR) (For US Only).
BAE, Sung-Su [KR/KR]; (KR) (For US Only)
Inventors: HWANG, Dong-June; (KR).
LIM, Jae-Bong; (KR).
LEEM, Seung-Do; (KR).
KIM, Tae-Young; (KR).
BAE, Sung-Su; (KR)
Agent: YOU ME PATENT & LAW FIRM; Seolim Bldg., 649-10, Yoksam-dong, Kangnam-ku, Seoul 135-080 (KR)
Priority Data:
Title (EN) METHOD OF PREPARING A HEAT-RESISTANT POLYAMIDE
(FR) PROCÉDÉ DE PRÉPARATION D'UN POLYAMIDE THERMORÉSISTANT
Abstract: front page image
(EN)The present invention relates to a method of prepairing a heat-resistant polyamide by carrying out condensation polymerisation with a monomer mixture including a diester compound and a diamine compound. The present invention provides an economical method of prepairing a heat-resistant polyamide in that a monomer, a raw material, is simply and chiefly prepared, and the polymerizing reaction time is short because it does not need solvent separately.
(FR)La présente invention a pour objet un procédé de préparation d'un polyamide thermorésistant par la mise en œuvre d'une polymérisation par condensation avec un mélange de monomères comprenant un composé diester et un composé diamine. La présente invention peut fournir un procédé économique de préparation du polyamide thermorésistant en ce qu'un monomère, qui est une matière première, est préparé simplement et spécifiquement, et que le temps de réaction de polymérisation est court car cette dernière ne nécessite pas l'utilisation d'un solvant séparément.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)