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1. (WO2010117098) METHOD OF PREPARING A HEAT-RESISTANT POLYAMIDE

Pub. No.:    WO/2010/117098    International Application No.:    PCT/KR2009/001857
Publication Date: Fri Oct 15 01:59:59 CEST 2010 International Filing Date: Sat Apr 11 01:59:59 CEST 2009
IPC: C08G 69/28
Applicants: SK CHEMICALS CO., LTD.
HWANG, Dong-June
LIM, Jae-Bong
LEEM, Seung-Do
KIM, Tae-Young
BAE, Sung-Su
Inventors: HWANG, Dong-June
LIM, Jae-Bong
LEEM, Seung-Do
KIM, Tae-Young
BAE, Sung-Su
Title: METHOD OF PREPARING A HEAT-RESISTANT POLYAMIDE
Abstract:
The present invention relates to a method of prepairing a heat-resistant polyamide by carrying out condensation polymerisation with a monomer mixture including a diester compound and a diamine compound. The present invention provides an economical method of prepairing a heat-resistant polyamide in that a monomer, a raw material, is simply and chiefly prepared, and the polymerizing reaction time is short because it does not need solvent separately.