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1. (WO2010117023) METAL-BASED CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2010/117023 International Application No.: PCT/JP2010/056327
Publication Date: 14.10.2010 International Filing Date: 07.04.2010
IPC:
H05K 1/05 (2006.01) ,B32B 15/08 (2006.01) ,B32B 15/09 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
05
Insulated metal substrate
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
09
comprising polyesters
Applicants:
草川 公一 KUSAKAWA, Kouichi [JP/JP]; JP (UsOnly)
許斐 和彦 KONOMI, Kazuhiko [JP/JP]; JP (UsOnly)
岡本 敏 OKAMOTO, Satoshi [JP/JP]; JP (UsOnly)
伊藤 豊誠 ITO, Toyonari [JP/JP]; JP (UsOnly)
日本発條株式会社 NHK SPRING CO., LTD. [JP/JP]; 神奈川県横浜市金沢区福浦3丁目10番地 3-10, Fukuura, Kanazawa-ku, Yokohama-shi, Kanagawa 2360004, JP (AllExceptUS)
住友化学株式会社 SUMITOMO CHEMICAL COMPANY, LIMITED [JP/JP]; 東京都中央区新川二丁目27番1号 27-1, Shinkawa 2-chome, Chuo-ku, Tokyo 1048260, JP (AllExceptUS)
Inventors:
草川 公一 KUSAKAWA, Kouichi; JP
許斐 和彦 KONOMI, Kazuhiko; JP
岡本 敏 OKAMOTO, Satoshi; JP
伊藤 豊誠 ITO, Toyonari; JP
Agent:
酒井 宏明 SAKAI, Hiroaki; 東京都千代田区霞が関三丁目2番5号 霞が関ビルディング 酒井国際特許事務所 Sakai International Patent Office, Kasumigaseki Building, 2-5, Kasumigaseki 3-chome, Chiyoda-ku, Tokyo 1006020, JP
Priority Data:
2009-09482109.04.2009JP
Title (EN) METAL-BASED CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
(FR) CARTE DE CIRCUIT À BASE DE MÉTAL ET SON PROCÉDÉ DE FABRICATION
(JA) 金属ベース回路基板およびその製造方法
Abstract:
(EN) Disclosed is a metal-based circuit board which comprises a metal substrate, an insulating layer that is arranged on the metal substrate, and a conductive foil that is arranged on the insulating layer for the formation of a circuit. The metal-based circuit board is characterized in that the metal substrate has a heat conductivity of not less than 60 W/mK and a thickness of 0.2-5.0 mm, and the insulating layer is formed using an insulating material composition that is obtained by dispersing an inorganic filler having a heat conductivity of not less than 30 W/mK into a non-anisotropic liquid crystal polyester solution. The metal-based circuit board exhibits high thermal stability and high electrical reliability, while having high heat conductivity at the same time. Consequently, the metal-based circuit board can be used in inverters or applications in which efficient heat dissipation is required.
(FR) L'invention porte sur une carte de circuit à base de métal qui comprend un substrat métallique, une couche isolante qui est agencée sur le substrat métallique et une feuille conductrice qui est agencée sur la couche isolante pour la formation d'un circuit. La carte de circuit à base de métal est caractérisée en ce que le substrat métallique a une conductivité thermique de pas moins de 60 W/mK et une épaisseur de 0,2-5,0 mm, et en ce que la couche isolante est formée à l'aide d'une composition de matériau isolant qui est obtenue par dispersion d'une charge inorganique ayant une conductivité thermique de pas moins de 30 W/mK dans une solution de polyester cristallin liquide non anisotrope. La carte de circuit à base de métal présente une stabilité thermique et une fiabilité électrique élevées, tout en ayant simultanément une conductivité thermique élevée. En conséquence, la carte de circuit à base de métal peut être utilisée dans des onduleurs ou des applications dans lesquelles une dissipation thermique efficace est nécessaire.
(JA)  本発明に係る金属ベース回路基板は、金属基板と該金属基板上に積層された絶縁層と該絶縁層上に積層された回路形成用の導電箔とを有してなる金属ベース回路基板であって、前記金属基板が熱伝導率60W/mK以上で厚みが0.2~5.0mmであり、前記絶縁層が、非異方性の液晶ポリエステル溶液に熱伝導率30W/mK以上の無機充填剤が分散されてなる絶縁材組成物を用いて形成されたものであることを特徴とする。本発明によれば、インバーターや高い放熱性を必要とする用途に適用可能な、高い熱伝導率を有すると同時に、熱安定性及び電気的信頼性の高い金属ベース回路基板を提供することができる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)