WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2010116993) STRUCTURE HAVING INTEGRATED CIRCUIT MOUNTED THEREIN
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/116993    International Application No.:    PCT/JP2010/056230
Publication Date: 14.10.2010 International Filing Date: 06.04.2010
IPC:
H05K 9/00 (2006.01), H01L 23/00 (2006.01), H01P 1/26 (2006.01), H05K 7/20 (2006.01)
Applicants: SHARP KABUSHIKI KAISHA [JP/JP]; 22-22, Nagaike-cho, Abeno-ku, Osaka-shi, Osaka 5458522 (JP) (For All Designated States Except US).
SAGESAKA, Hiroshi; (For US Only).
OKUBO, Masanori; (For US Only).
KUBOTA, Hidemasa; (For US Only)
Inventors: SAGESAKA, Hiroshi; .
OKUBO, Masanori; .
KUBOTA, Hidemasa;
Agent: FUKAMI, Hisao; Fukami Patent Office, Nakanoshima Central Tower, 22nd Floor, 2-7, Nakanoshima 2-chome, Kita-ku, Osaka-shi, Osaka 5300005 (JP)
Priority Data:
2009-093192 07.04.2009 JP
Title (EN) STRUCTURE HAVING INTEGRATED CIRCUIT MOUNTED THEREIN
(FR) STRUCTURE CONTENANT UN CIRCUIT INTÉGRÉ
(JA) 集積回路の搭載構造
Abstract: front page image
(EN)Provided is a structure having an integrated circuit mounted therein, by which EMI in an electronic apparatus having the integrated circuit mounted on a printed board is reduced. A heat sink (2) is provided in contact with an integrated circuit package (7). A circuit element (5) having electric loss is provided between the heat sink (2) and second wiring (4).
(FR)La présente invention concerne une structure dans laquelle un circuit intégré a été monté, permettant de réduire les EMI (interférences électromagnétiques) dans un appareil électronique dans lequel le circuit électrique a été monté sur une carte de circuit imprimé. Un dissipateur thermique (2) est placé en contact avec un module de circuit intégré (7). Un élément circuit (5) ayant une perte électrique est placé entre le dissipateur thermique (2) et le second câblage (4).
(JA) プリント基板上に搭載される集積回路を有する電子機器におけるEMIを低減させる事を目的とする。集積回路パッケージ(7)と当接するようにヒートシンク(2)が設けられる。ヒートシンク(2)と第2の配線(4)との間に電気的損失性を有する回路素子(5)が設けられる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)