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1. (WO2010116891) HEAT-CONDUCTIVE MASSIVE ADHESIVE AGENT, HEAT-CONDUCTIVE ADHESIVE SHEET AND METHOD FOR PRODUCING SAME

Pub. No.:    WO/2010/116891    International Application No.:    PCT/JP2010/055215
Publication Date: Fri Oct 15 01:59:59 CEST 2010 International Filing Date: Fri Mar 26 00:59:59 CET 2010
IPC: C09J 201/00
C09J 7/00
C09J 11/00
C09J 11/04
C09J 11/06
C09J 163/00
H01L 23/36
H01L 23/373
Applicants: POLYMATECH CO. , LTD.
ポリマテック株式会社
KUDOH Hiroki
工藤 大希
NUNOKAWA Takehiko
布川 雄彦
Inventors: KUDOH Hiroki
工藤 大希
NUNOKAWA Takehiko
布川 雄彦
Title: HEAT-CONDUCTIVE MASSIVE ADHESIVE AGENT, HEAT-CONDUCTIVE ADHESIVE SHEET AND METHOD FOR PRODUCING SAME
Abstract:
Provided is a technique whereby, after forming a massive solid adhesive agent, a heat-conductive sheet having a thickness suitable for use can be prepared. By forming a heat-conductive solid adhesive agent (11) which is in the form of a single "block", a heat-conductive adhesive sheet (12), which is in the form of a "sheet" having a thickness suitable for each use, can be easily obtained by cutting or the like. When the heat-conductive adhesive sheet (12) is positioned between adherends and then a reaction with a latent curing agent is carried out, the latent curing agent reacts with a polymer base material (13) and thus the adherends can be adhered together.