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1. (WO2010116582) LIQUID SEALING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING LIQUID SEALING RESIN COMPOSITION, AND METHOD FOR PRODUCING SAME

Pub. No.:    WO/2010/116582    International Application No.:    PCT/JP2010/000495
Publication Date: Fri Oct 15 01:59:59 CEST 2010 International Filing Date: Fri Jan 29 00:59:59 CET 2010
IPC: C08L 63/00
C08G 59/02
H01L 21/60
H01L 23/29
H01L 23/31
Applicants: SUMITOMO BAKELITE CO., LTD.
住友ベークライト株式会社
ITO, Hiroshi
伊藤浩志
Inventors: ITO, Hiroshi
伊藤浩志
Title: LIQUID SEALING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING LIQUID SEALING RESIN COMPOSITION, AND METHOD FOR PRODUCING SAME
Abstract:
Disclosed is a liquid sealing resin composition containing (A) an epoxy resin, (B) an amine-based curing agent, and (C) a basic compound, wherein when the liquid sealing resin composition is filled between a semiconductor element and a substrate connected to each other by solder bumps, the residue of a fluxing agent used when connecting the semiconductor element and the substrate by solder bumps is removed.