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1. (WO2010114238) CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SAME

Pub. No.:    WO/2010/114238    International Application No.:    PCT/KR2010/001582
Publication Date: Fri Oct 08 01:59:59 CEST 2010 International Filing Date: Tue Mar 16 00:59:59 CET 2010
IPC: H05K 1/02
H05K 7/20
Applicants: CORESEM INC.
코아셈㈜
LEE, Hwan Chul
이환철
KIM, Jun Tae
김준태
Inventors: LEE, Hwan Chul
이환철
KIM, Jun Tae
김준태
Title: CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SAME
Abstract:
The present invention relates to a circuit board with improved heat transfer performance and breakdown voltage, as well as to a method for manufacturing same. The circuit board, according to one embodiment of the present invention, comprises: a base; an insulating layer formed on the base and having air pores; a sealing layer formed on the insulating layer, and filling the air pores; an adhesive layer formed on the sealing layer; and a wiring layer formed on the adhesive layer.