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1. (WO2010114115) PACKAGE MEMBER ASSEMBLY, METHOD FOR MANUFACTURING PACKAGE MEMBER ASSEMBLY, PACKAGE MEMBER, AND METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATION DEVICE USING PACKAGE MEMBER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/114115    International Application No.:    PCT/JP2010/056055
Publication Date: 07.10.2010 International Filing Date: 02.04.2010
IPC:
H03H 3/02 (2006.01), H01L 23/04 (2006.01), H01L 23/08 (2006.01), H03H 9/02 (2006.01)
Applicants: DAISHINKU CORPORATION [JP/JP]; 1389, Aza-Kono, Shinzaike, Hiraoka-cho, Kakogawa-shi, Hyogo 6750194 (JP) (For All Designated States Except US).
SATOH, Syunsuke [JP/JP]; (JP) (For US Only).
KOHDA, Naoki [JP/JP]; (JP) (For US Only).
YOSHIOKA, Hiroki [JP/JP]; (JP) (For US Only)
Inventors: SATOH, Syunsuke; (JP).
KOHDA, Naoki; (JP).
YOSHIOKA, Hiroki; (JP)
Agent: ARC PATENT ATTORNEYS' OFFICE; Sumitomoseimei Midosuji Bldg., 14-3, Nishitemma 4-chome, Kita-ku, Osaka-shi, Osaka 5300047 (JP)
Priority Data:
2009-090623 03.04.2009 JP
Title (EN) PACKAGE MEMBER ASSEMBLY, METHOD FOR MANUFACTURING PACKAGE MEMBER ASSEMBLY, PACKAGE MEMBER, AND METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATION DEVICE USING PACKAGE MEMBER
(FR) ENSEMBLE D'ÉLÉMENTS DE BOÎTIER, PROCÉDÉ DE FABRICATION DE L'ENSEMBLE D'ÉLÉMENTS DE BOÎTIER, ÉLÉMENT DE BOÎTIER, ET PROCÉDÉ DE FABRICATION DE DISPOSITIF VIBRANT PIÉZOÉLECTRIQUE UTILISANT L'ÉLÉMENT DE BOÎTIER
(JA) パッケージ部材集合体、パッケージ部材集合体の製造方法、パッケージ部材、およびパッケージ部材を用いた圧電振動デバイスの製造方法
Abstract: front page image
(EN)Provided is a package member assembly wherein a plurality of package members are integrally formed. The package member assembly has a plurality of bottomed holes in the front main surface and the rear main surface of a wafer composed of glass, and on the rear main surface, external terminals each of which is connected with the side surface conductor bonded on the inner wall surface of each of the bottomed holes are formed.
(FR)La présente invention se rapporte à un ensemble d'éléments de boîtier dans lequel une pluralité d'éléments de boîtier est formée d'un seul tenant. L'ensemble d'éléments de boîtier comprend une pluralité de trous percés dans le fond de la surface principale antérieure et de la surface principale postérieure d'une tranche réalisée en verre. De plus, sur la surface principale postérieure, des bornes externes sont formées, ces bornes externes étant connectées chacune au conducteur de surface latérale qui est collé sur la surface de paroi intérieure de chacun des trous réalisés dans le fond des surfaces principales de la tranche.
(JA)【解決手段】 パッケージ部材集合体は、複数のパッケージ部材が一体形成されている。パッケージ部材集合体は、ガラスからなるウエハの表主面および裏主面に、複数の有底孔を有し、裏主面には有底孔の内壁面に被着された側面導体と繋がった外部端子が形成されている。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)