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1. (WO2010113858) HEAT PUMP DEVICE

Pub. No.:    WO/2010/113858    International Application No.:    PCT/JP2010/055543
Publication Date: Fri Oct 08 01:59:59 CEST 2010 International Filing Date: Tue Mar 30 01:59:59 CEST 2010
IPC: F25B 43/00
F25B 1/053
Applicants: MITSUBISHI HEAVY INDUSTRIES, LTD.
三菱重工業株式会社
NISHII, Kenichiro
西井 健一朗
UEDA, Kenji
上田 憲治
WAJIMA, Kazuki
和島 一喜
Inventors: NISHII, Kenichiro
西井 健一朗
UEDA, Kenji
上田 憲治
WAJIMA, Kazuki
和島 一喜
Title: HEAT PUMP DEVICE
Abstract:
Provided is a heat pump device wherein noises generated during a partial load operation can be easily insulated. The heat pump device is comprised of a turbo compressor (6) which compresses a refrigerant; a condenser (2) which condenses the compressed refrigerant; an expansion valve (3) which adiabatically expands the condensed refrigerant; an evaporator (4) which evaporates the adiabatically-expanded refrigerant; a container (5) to which the evaporated refrigerant is introduced, and through which the introduced refrigerant is discharged to the turbo compressor (6); a noise insulation portion (51) which surrounds the periphery of the container (5), and prevents noises generated within the container (5) from leaking to the outside; a bypass passage (8) through which a part of the refrigerant passing between the turbo compressor (6) and the condenser (2) is introduced to the container (5); and a flow rate control portion (9) which controls the flow rate of the refrigerant passing through the bypass passage (8).