Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2010113833) FLUX COMPOSITION FOR LEAD-FREE SOLDER, AND LEAD-FREE SOLDER COMPOSITION
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2010/113833 International Application No.: PCT/JP2010/055505
Publication Date: 07.10.2010 International Filing Date: 29.03.2010
IPC:
B23K 35/363 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
36
Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
362
Selection of compositions of fluxes
363
for soldering or brazing
Applicants:
岩村 栄治 IWAMURA, Eiji [JP/JP]; JP (UsOnly)
北浦 知憲 KITAURA, Tomonori [JP/JP]; JP (UsOnly)
荒川化学工業株式会社 ARAKAWA CHEMICAL INDUSTRIES, LTD. [JP/JP]; 大阪府大阪市中央区平野町1丁目3番7号 3-7, Hiranomachi 1-chome, Chuo-ku, Osaka-shi, Osaka 5410046, JP (AllExceptUS)
Inventors:
岩村 栄治 IWAMURA, Eiji; JP
北浦 知憲 KITAURA, Tomonori; JP
Agent:
岩谷 龍 IWATANI, Ryo; 大阪府大阪市北区堂島2丁目1番31号 京阪堂島ビル3階 KEIHAN Dojima Bldg. 3F, 1-31, Dojima 2-chome, Kita-ku, Osaka-shi, Osaka 5300003, JP
Priority Data:
2009-08281930.03.2009JP
Title (EN) FLUX COMPOSITION FOR LEAD-FREE SOLDER, AND LEAD-FREE SOLDER COMPOSITION
(FR) COMPOSITION DE FLUX POUR BRASURE SANS PLOMB ET COMPOSITION DE BRASURE SANS PLOMB
(JA) 鉛フリーはんだ用フラックス組成物及び鉛フリーはんだ組成物
Abstract:
(EN) Disclosed is a flux composition for a lead-free solder, which is characterized by containing components derived from rosins. The components derived from rosins include a (meth)acrylic acid-modified rosin, dehydroabietic acid and dihydroabietic acid; and the dehydroabietic acid content is 7-65% by weight and the dihydroabietic acid content is 3-57% by weight with respect to the total amount of the components derived from rosins. Also disclosed is a lead-free solder composition which contains the flux composition and a lead-free solder alloy.
(FR) L'invention porte sur une composition de flux pour brasure sans plomb, qui est caractérisée en ce qu'elle contient des composants issus des colophanes. Les composants issus des colophanes renferment une colophane modifiée par acide (méth)acrylique, de l'acide déhydroabiétique et de l'acide dihydroabiétique ; et la teneur en acide déhydroabiétique est de 7 à 65 % en poids et la teneur en acide dihydroabiétique est de 3 à 57 % en poids par rapport à la quantité totale des composants issus des colophanes. L'invention porte également sur une composition de brasure sans plomb qui contient la composition de flux et sur un alliage de brasure sans plomb.
(JA)  (メタ)アクリル酸変性ロジン、デヒドロアビエチン酸、及びジヒドロアビエチン酸を含むロジン類由来成分であって、ロジン類由来成分の全量に対して、デヒドロアビエチン酸の含有量が7~65重量%であり、ジヒドロアビエチン酸の含有量が3~57重量%であるロジン類由来成分を含有することを特徴とする鉛フリーはんだ用フラックス組成物。このフラックス組成物と鉛フリーはんだ合金とを含む鉛フリーはんだ組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)